Manuels d'utilisation pour Intel 2 Duo T7300

Table des matières

• Intel® Core™2 Duo Processors and Intel® Core™2 Extreme Processors for Platforms Based on Mobile Intel® 965 Express Chipset Family

  1
• Contents

  3
• Revision History

  5
• 1 Introduction

  7
  • 1.1 Terminology

    8
  • 1.2 References

    9
• 2 Low Power Features

  11
  • 2.1 Clock Control and Low Power States

    11
    • 2.1.1 Core Low Power State Descriptions

      13
    • 2.1.2 Package Low Power State Descriptions

      15
  • 2.2 Enhanced Intel SpeedStep® Technology

    18
    • 2.2.1 Dynamic FSB Frequency Switching

      19
    • 2.2.2 Intel® Dynamic Acceleration Technology

      19
  • 2.3 Extended Low Power States

    19
  • 2.4 FSB Low Power Enhancements

    20
  • 2.5 VID-x

    20
  • 2.6 Processor Power Status Indicator (PSI-2) Signal

    21
• 3 Electrical Specifications

  23
  • 3.1 Power and Ground Pins

    23
  • 3.2 FSB Clock (BCLK[1:0]) and Processor Clocking

    23
  • 3.3 Voltage Identification

    23
  • 3.4 Catastrophic Thermal Protection

    26
  • 3.5 Reserved and Unused Pins

    26
  • 3.6 FSB Frequency Select Signals (BSEL[2:0])

    27
  • 3.7 FSB Signal Groups

    27
  • 3.8 CMOS Signals

    29
  • 3.9 Maximum Ratings

    29
  • 3.10 Processor DC Specifications

    30
• 4 Package Mechanical Specifications and Pin Information

  41
  • 4.1 Package Mechanical Specifications

    41
  • 4.2 Processor Pinout and Pin List

    49
  • 4.3 Alphabetical Signals Reference

    69
• 5 Thermal Specifications and Design Considerations

  77
  • 5.1 Thermal Specifications

    80
    • 5.1.1 Thermal Diode

      81
    • 5.1.2 Thermal Diode Offset

      83
    • 5.1.3 Intel® Thermal Monitor

      84
    • 5.1.4 Digital Thermal Sensor

      86
    • 5.1.5 Out of Specification Detection

      87
    • 5.1.6 PROCHOT# Signal Pin

      87