Manuels d'utilisation pour Intel Core 2 Duo E8230

Table des matières

• 1 Introduction

  9
  • 1.1 Terminology

    10
    • 1.1.1 Processor Terminology Definitions

      10
  • 1.2 References

    12
• 2 Electrical Specifications

  13
  • 2.1 Power and Ground Lands

    13
  • 2.2 Decoupling Guidelines

    13
    • 2.2.1 VCC Decoupling

      13
    • 2.2.2 VTT Decoupling

      13
    • 2.2.3 FSB Decoupling

      14
  • 2.3 Voltage Identification

    14
  • 2.4 Reserved, Unused, and TESTHI Signals

    16
  • 2.5 Power Segment Identifier (PSID)

    16
  • 2.6 Voltage and Current Specification

    17
    • 2.6.1 Absolute Maximum and Minimum Ratings

      17
    • 2.6.2 DC Voltage and Current Specification

      18
    • 2.6.3 VCC Overshoot

      23
    • 2.6.4 Die Voltage Validation

      24
  • 2.7 Signaling Specifications

    24
    • 2.7.1 FSB Signal Groups

      25
    • 2.7.2 CMOS and Open Drain Signals

      26
    • 2.7.3 Processor DC Specifications

      27
      • 2.7.3.1 Platform Environment Control Interface (PECI) DC Specifications

        29
      • 2.7.3.2 GTL+ Front Side Bus Specifications

        30
  • 2.8 Clock Specifications

    31
    • 2.8.1 Front Side Bus Clock (BCLK[1:0]) and Processor Clocking

      31
    • 2.8.2 FSB Frequency Select Signals (BSEL[2:0])

      32
    • 2.8.3 Phase Lock Loop (PLL) and Filter

      32
    • 2.8.4 BCLK[1:0] Specifications

      32
• 3 Package Mechanical Specifications

  35
  • 3.1 Package Mechanical Drawing

    35
  • 3.2 Processor Component Keep-Out Zones

    39
  • 3.3 Package Loading Specifications

    39
  • 3.4 Package Handling Guidelines

    39
  • 3.5 Package Insertion Specifications

    40
  • 3.6 Processor Mass Specification

    40
  • 3.7 Processor Materials

    40
  • 3.8 Processor Markings

    40
  • 3.9 Processor Land Coordinates

    41
• 4 Land Listing and Signal Descriptions

  43
  • 4.1 Processor Land Assignments

    43
  • 4.2 Alphabetical Signals Reference

    66
• 5 Thermal Specifications and Design Considerations

  77
  • 5.1 Processor Thermal Specifications

    77
    • 5.1.1 Thermal Specifications

      77
    • 5.1.2 Thermal Metrology

      81
  • 5.2 Processor Thermal Features

    81
    • 5.2.1 Thermal Monitor

      81
    • 5.2.2 Thermal Monitor 2

      82
    • 5.2.3 On-Demand Mode

      83
    • 5.2.4 PROCHOT# Signal

      84
    • 5.2.5 THERMTRIP# Signal

      84
  • 5.3 Platform Environment Control Interface (PECI)

    85
    • 5.3.1 Introduction

      85
      • 5.3.1.1 TCONTROL and TCC activation on PECI-Based Systems

        85
    • 5.3.2 PECI Specifications

      86
      • 5.3.2.1 PECI Device Address

        86
      • 5.3.2.2 PECI Command Support

        86
      • 5.3.2.3 PECI Fault Handling Requirements

        86
      • 5.3.2.4 PECI GetTemp0() Error Code Support

        86
• 6 Features

  87
  • 6.1 Power-On Configuration Options

    87
  • 6.2 Clock Control and Low Power States

    87
    • 6.2.1 Normal State

      88
    • 6.2.2 HALT and Extended HALT Powerdown States

      88
      • 6.2.2.1 HALT Powerdown State

        88
      • 6.2.2.2 Extended HALT Powerdown State

        89
    • 6.2.3 Stop Grant and Extended Stop Grant States

      89
      • 6.2.3.1 Stop-Grant State

        89
      • 6.2.3.2 Extended Stop Grant State

        90
    • 6.2.4 Extended HALT Snoop State, HALT Snoop State, Extended Stop Grant Snoop State, and Stop Grant Snoop State

      90
      • 6.2.4.1 HALT Snoop State, Stop Grant Snoop State

        90
      • 6.2.4.2 Extended HALT Snoop State, Extended Stop Grant Snoop State

        90
    • 6.2.5 Sleep State

      90
    • 6.2.6 Deep Sleep State

      91
    • 6.2.7 Deeper Sleep State

      91
    • 6.2.8 Enhanced Intel SpeedStep® Technology

      92
  • 6.3 Processor Power Status Indicator (PSI) Signal

    92
• 7 Boxed Processor Specifications

  93
  • 7.1 Introduction

    93
  • 7.2 Mechanical Specifications

    94
    • 7.2.1 Boxed Processor Cooling Solution Dimensions

      94
    • 7.2.2 Boxed Processor Fan Heatsink Weight

      95
    • 7.2.3 Boxed Processor Retention Mechanism and Heatsink Attach Clip Assembly

      95
  • 7.3 Electrical Requirements

    95
    • 7.3.1 Fan Heatsink Power Supply

      95
  • 7.4 Thermal Specifications

    97
    • 7.4.1 Boxed Processor Cooling Requirements

      97
    • 7.4.2 Variable Speed Fan

      99
• 8 Debug Tools Specifications

  101
  • 8.1 Logic Analyzer Interface (LAI)

    101
    • 8.1.1 Mechanical Considerations

      101
    • 8.1.2 Electrical Considerations

      101