Manuel D’Utilisation (AT80602002937AB)Table des matières1 Introduction91.1 Terminology101.2 References121.3 Statement of Volatility122 Intel® Xeon® Processors 5500 Series Electrical Specifications132.1 Processor Signaling132.1.1 Intel® QuickPath Interconnect132.1.2 DDR3 Signal Groups132.1.3 Platform Environmental Control Interface (PECI)142.1.4 Processor Sideband Signals142.1.5 System Reference Clock142.1.6 Test Access Port (TAP) Signals152.1.7 Power / Other Signals152.1.8 Reserved or Unused Signals232.2 Signal Group Summary232.3 Mixing Processors252.4 Flexible Motherboard Guidelines (FMB)262.5 Absolute Maximum and Minimum Ratings262.6 Processor DC Specifications272.6.1 VCC Overshoot Specifications312.6.2 Die Voltage Validation323 Package Mechanical Specifications433.1 Package Mechanical Specifications433.1.1 Package Mechanical Drawing443.1.2 Processor Component Keep-Out Zones473.1.3 Package Loading Specifications473.1.4 Package Handling Guidelines473.1.5 Package Insertion Specifications473.1.6 Processor Mass Specification483.1.7 Processor Materials483.1.8 Processor Markings483.1.9 Processor Land Coordinates484 Land Listing494.1 Intel® Xeon® Processors 5500 Series Pin Assignments494.1.1 Land Listing by Land Name494.1.2 Land Listing by Land Number675 Signal Definitions855.1 Signal Definitions856 Thermal Specifications896.1 Package Thermal Specifications896.1.1 Thermal Specifications896.1.2 Thermal Metrology1026.2 Processor Thermal Features1036.2.1 Processor Temperature1036.2.2 Adaptive Thermal Monitor1036.2.3 On-Demand Mode1056.2.4 PROCHOT# Signal1056.2.5 THERMTRIP# Signal1066.3 Platform Environment Control Interface (PECI)1066.3.1 PECI Client Capabilities1076.3.2 Client Command Suite1086.3.3 Multi-Domain Commands1246.3.4 Client Responses1246.3.5 Originator Responses1256.3.6 Temperature Data1266.3.7 Client Management1277 Features1317.1 Power-On Configuration (POC)1317.2 Clock Control and Low Power States1327.2.1 Thread and Core Power State Descriptions1337.2.2 Package Power State Descriptions1347.2.3 Intel Xeon Processor 5500 Series C-State Power Specifications1357.3 Sleep States1367.4 Intel® Turbo Boost Technology1367.5 Enhanced Intel SpeedStep® Technology1368 Boxed Processor Specifications1378.1 Introduction1378.1.1 Available Boxed Thermal Solution Configurations1378.1.2 An Intel “Combo” Boxed Passive / Active Combination Heat Sink Solution1378.1.3 Intel Boxed “Active” Heat Sink Solution1388.1.4 Intel Boxed 25.5mm Tall Passive Heat Sink Solution1398.2 Mechanical Specifications1408.2.1 Boxed Processor Heat Sink Dimensions and Baseboard Keepout Zones1408.2.2 Boxed Processor Retention Mechanism and Heat Sink Support (URS)1498.3 Fan Power Supply (“Combo” and “Active” Solution)1508.3.1 Boxed Processor Cooling Requirements1518.4 Boxed Processor Contents153Taille: 2,9 MoPages: 154Language: EnglishOuvrir le manuel