Manuels d'utilisation pour Intel Pentium M 770

Table des matières

• Contents

  3
• 1 Introduction

  7
  • 1.1 Terminology

    7
  • 1.2 References

    8
• 2 Low Power Features

  9
  • 2.1 Clock Control and Low Power States

    9
    • 2.1.1 Core Low-Power States

      11
      • 2.1.1.1 C0 State

        11
      • 2.1.1.2 C1/AutoHALT Powerdown State

        11
      • 2.1.1.3 C1/MWAIT Powerdown State

        11
      • 2.1.1.4 Core C2 State

        11
      • 2.1.1.5 Core C3 State

        11
    • 2.1.2 Package Low Power States

      12
      • 2.1.2.1 Normal State

        12
      • 2.1.2.2 Stop-Grant State

        12
      • 2.1.2.3 Stop Grant Snoop State

        12
      • 2.1.2.4 Sleep State

        12
      • 2.1.2.5 Deep Sleep State

        13
  • 2.2 Enhanced Intel SpeedStep® Technology

    13
  • 2.3 FSB Low Power Enhancements

    14
  • 2.4 Processor Power Status Indicator (PSI#) Signal

    15
• 3 Electrical Specifications

  17
  • 3.1 Power and Ground Pins

    17
  • 3.2 FSB Clock (BCLK[1:0]) and Processor Clocking

    17
  • 3.3 Voltage Identification

    17
  • 3.4 Catastrophic Thermal Protection

    20
  • 3.5 Signal Terminations and Unused Pins

    21
  • 3.6 FSB Frequency Select Signals (BSEL[2:0])

    21
  • 3.7 FSB Signal Groups

    21
  • 3.8 CMOS Signals

    23
  • 3.9 Maximum Ratings

    23
  • 3.10 Processor DC Specifications

    24
• 4 Package Mechanical Specifications and Pin Information

  29
  • 4.1 Package Mechanical Specifications

    29
  • 4.2 Processor Pinout and Pin List

    32
  • 4.3 Alphabetical Signals Reference

    55
• 5 Thermal Specifications and Design Considerations

  63
  • 5.1 Monitoring Processor Temperature

    64
    • 5.1.1 Thermal Diode

      64
    • 5.1.2 Thermal Diode Offset

      66
    • 5.1.3 Intel® Thermal Monitor

      67
    • 5.1.4 Digital Thermal Sensor

      68
    • 5.1.5 Out of Specification Detection

      69