Manuel D’UtilisationTable des matièresChapter 1 Product Overview6Overview6Documentation Overview6Related Documentation6mbed Documentation6Programming the xDot Microcontroller7General mBed Links7xDot Platform7EUI and Networking7Product Build Options8Chapter 2 Getting Started9Getting Started with the xDot Developer Kit9COM Port Enumeration by Operating System9Linux9Windows9Mac10Chapter 3 Mechanical Drawings with Pinouts11xDot11Chapter 4 Specifications and Pin Information12MTXDOT Specifications12Mapping Data Rate to Spreading Factor/Bandwidth14Power Draw15Measuring the Power Draw15Electrical Characteristics16xDot and Processor Pin Information16Pin Information16Pull-Up/Down19xDot Pinout Design Notes20Serial Pinout Notes20Serial Settings20LoRa20Throughput Rates20Range20Chapter 5 Antennas22Antenna System22U.FL and Trace Antenna Options22Pulse Electronics Antenna23Antenna Specifications23RSMA-to-U.FL Coaxial Cables24Coaxial Cable Specifications24Ethertronics Chip Antenna25Antenna Specifications25Stackup Information25Developer Board Layer Stackup25Stackup Table26Impedance26Chip Antenna Design Guidelines28Antenna Pad Layout29PCB Layout29OEM Integration30FCC & IC Information to Consumers30FCC Grant Notes30Host Labeling30Chapter 6 Safety Information31Handling Precautions31Radio Frequency (RF) Safety31Sécurité relative aux appareils à radiofréquence (RF)31Interference with Pacemakers and Other Medical Devices32Potential interference32Precautions for pacemaker wearers32Device Maintenance32User Responsibility32Chapter 7 Regulatory Information33EMC, Safety, and R&TTE Directive Compliance3347 CFR Part 15 Regulation Class B Devices33FCC Interference Notice33FCC Notice33Industry Canada Class B Notice34Chapter 8 Environmental Notices35Waste Electrical and Electronic Equipment Statement35WEEE Directive35Instructions for Disposal of WEEE by Users in the European Union35REACH Statement36Registration of Substances36Substances of Very High Concern (SVHC)36Restriction of the Use of Hazardous Substances (RoHS)37Information on HS/TS Substances According to Chinese Standards38Information on HS/TS Substances According to Chinese Standards (in Chinese)39Chapter 9 Labels40Label Examples40Chapter 10 Developer Kit Overview41xDot Developer Kit41Developer Kit Package Contents41Firmware Updates41Programming Devices in Production41xDot Developer Kit Mechanical Drawings42Micro Developer Board LEDs43Chapter 11 Developer Board Schematics44Assembly Diagrams and Schematics44Assembly Diagrams44Schematics46Chapter 12 Design Considerations50Noise Suppression Design50PC Board Layout Guideline50Electromagnetic Interference50Electrostatic Discharge Control51Chapter 13 Mounting xDots and Programming External Targets52Mounting the Device on Your Board52Solder Profile52Setpoints (Celsius)53xDot Packing53Programming External Targets53JTAG/SWD Connector54Index55Taille: 3,7 MoPages: 56Language: EnglishOuvrir le manuel