Manuels d'utilisation pour Nxp Semiconductors OM11043

Table des matières

• 1. General description

  1
• 2. Features and benefits

  1
• 3. Applications

  4
• 4. Ordering information

  4
  • 4.1 Ordering options

    4
• 5. Marking

  5
• 6. Block diagram

  6
• 7. Pinning information

  7
  • 7.1 Pinning

    7
  • 7.2 Pin description

    10
• 8. Functional description

  21
  • 8.1 Architectural overview

    21
  • 8.2 ARM Cortex-M3 processor

    21
  • 8.3 On-chip flash program memory

    21
  • 8.4 On-chip SRAM

    21
  • 8.5 Memory Protection Unit (MPU)

    21
  • 8.6 Memory map

    22
  • 8.7 Nested Vectored Interrupt Controller (NVIC)

    24
    • 8.7.1 Features

      24
    • 8.7.2 Interrupt sources

      24
  • 8.8 Pin connect block

    24
  • 8.9 General purpose DMA controller

    24
    • 8.9.1 Features

      25
  • 8.10 Fast general purpose parallel I/O

    25
    • 8.10.1 Features

      26
  • 8.11 Ethernet

    26
    • 8.11.1 Features

      26
  • 8.12 USB interface

    27
    • 8.12.1 USB device controller

      27
      • 8.12.1.1 Features

        27
    • 8.12.2 USB host controller

      28
      • 8.12.2.1 Features

        28
    • 8.12.3 USB OTG controller

      28
      • 8.12.3.1 Features

        28
  • 8.13 CAN controller and acceptance filters

    28
    • 8.13.1 Features

      29
  • 8.14 12-bit ADC

    29
    • 8.14.1 Features

      29
  • 8.15 10-bit DAC

    29
    • 8.15.1 Features

      29
  • 8.16 UARTs

    30
    • 8.16.1 Features

      30
  • 8.17 SPI serial I/O controller

    30
    • 8.17.1 Features

      30
  • 8.18 SSP serial I/O controller

    30
    • 8.18.1 Features

      31
  • 8.19 I2C-bus serial I/O controllers

    31
    • 8.19.1 Features

      31
  • 8.20 I2S-bus serial I/O controllers

    32
    • 8.20.1 Features

      32
  • 8.21 General purpose 32-bit timers/external event counters

    32
    • 8.21.1 Features

      32
  • 8.22 Pulse width modulator

    33
    • 8.22.1 Features

      33
  • 8.23 Motor control PWM

    34
  • 8.24 Quadrature Encoder Interface (QEI)

    34
    • 8.24.1 Features

      34
  • 8.25 Repetitive Interrupt (RI) timer

    35
    • 8.25.1 Features

      35
  • 8.26 ARM Cortex-M3 system tick timer

    35
  • 8.27 Watchdog timer

    35
    • 8.27.1 Features

      35
  • 8.28 RTC and backup registers

    36
    • 8.28.1 Features

      36
  • 8.29 Clocking and power control

    36
    • 8.29.1 Crystal oscillators

      36
      • 8.29.1.1 Internal RC oscillator

        37
      • 8.29.1.2 Main oscillator

        37
      • 8.29.1.3 RTC oscillator

        37
    • 8.29.2 Main PLL (PLL0)

      38
    • 8.29.3 USB PLL (PLL1)

      38
    • 8.29.4 RTC clock output

      38
    • 8.29.5 Wake-up timer

      38
    • 8.29.6 Power control

      39
      • 8.29.6.1 Sleep mode

        39
      • 8.29.6.2 Deep-sleep mode

        39
      • 8.29.6.3 Power-down mode

        40
      • 8.29.6.4 Deep power-down mode

        40
      • 8.29.6.5 Wake-up interrupt controller

        40
    • 8.29.7 Peripheral power control

      40
    • 8.29.8 Power domains

      41
  • 8.30 System control

    42
    • 8.30.1 Reset

      42
    • 8.30.2 Brownout detection

      43
    • 8.30.3 Code security (Code Read Protection - CRP)

      43
    • 8.30.4 APB interface

      43
    • 8.30.5 AHB multilayer matrix

      44
    • 8.30.6 External interrupt inputs

      44
    • 8.30.7 Memory mapping control

      44
  • 8.31 Emulation and debugging

    44
• 9. Limiting values

  45
• 10. Thermal characteristics

  46
• 11. Static characteristics

  47
  • 11.1 Power consumption

    50
  • 11.2 Peripheral power consumption

    53
  • 11.3 Electrical pin characteristics

    54
• 12. Dynamic characteristics

  56
  • 12.1 Flash memory

    56
  • 12.2 External clock

    56
  • 12.3 Internal oscillators

    57
  • 12.4 I/O pins

    57
  • 12.5 I2C-bus

    58
  • 12.6 I2S-bus interface

    59
  • 12.7 SSP interface

    61
  • 12.8 USB interface

    63
  • 12.9 SPI

    64
• 13. ADC electrical characteristics

  66
• 14. DAC electrical characteristics

  69
• 15. Application information

  70
  • 15.1 Suggested USB interface solutions

    70
  • 15.2 Crystal oscillator XTAL input and component selection

    73
  • 15.3 XTAL and RTCX Printed Circuit Board (PCB) layout guidelines

    74
  • 15.4 Standard I/O pin configuration

    75
  • 15.5 Reset pin configuration

    76
  • 15.6 ElectroMagnetic Compatibility (EMC)

    77
• 16. Package outline

  78
• 17. Soldering

  81
• 18. Abbreviations

  83
• 19. References

  83
• 20. Revision history

  84
• 21. Legal information

  86
  • 21.1 Data sheet status

    86
  • 21.2 Definitions

    86
  • 21.3 Disclaimers

    86
  • 21.4 Trademarks

    87
• 22. Contact information

  87
• 23. Contents

  88