Manuel D’UtilisationTable des matièresFeatures2General description2Ordering information2Quick reference data3Block diagram4Pinning5Functional description6Limiting values6Thermal characteristics7DCcharacteristics7ACcharacteristics8Application information10Package outlines13Soldering17Introduction17Through-hole mount packages17Surface mount packages17Suitability of IC packages for wave, reflow and dipping soldering methods18Data sheet status20Definitions20Disclaimers20Taille: 140 koPages: 21Language: EnglishOuvrir le manuel
Manuel D’UtilisationTable des matièresFeatures2General description2Ordering information2Quick reference data3Block diagram4Pinning5Functional description6Limiting values6Thermal characteristics7DCcharacteristics7ACcharacteristics8Application information10Package outlines13Soldering17Introduction17Through-hole mount packages17Surface mount packages17Suitability of IC packages for wave, reflow and dipping soldering methods18Data sheet status20Definitions20Disclaimers20Taille: 140 koPages: 21Language: EnglishOuvrir le manuel