Manuel D’UtilisationTable des matières1. General description12. Features13. Applications14. Quick reference data25. Ordering information26. Block diagram37. Pinning information47.1 Pinning47.2 Pin description48. Functional description58.1 V/I converters58.2 Output amplifiers58.3 Buffer58.4 Dynamic quiescent controller68.5 Stabilizer68.6 Input logic68.7 Reference69. Internal circuitry710. Limiting values1011. Thermal characteristics1012. Characteristics1013. Application information1113.1 General1113.2 Heatsink design1213.3 Test conditions1213.4 Input configurations1313.5 Standby/mute1413.6 Application1: SE with loudspeaker capacitor1413.7 Application2: SE to buffer (without loudspeaker capacitor)1413.8 Application3: Improved SE to buffer (without loudspeaker capacitor)1413.9 Application4: Bridge tied load mono amplifier1413.10 Application5: Line driver application1413.11 Application6: Line driver application1413.12 Application7: Line driver application1513.13 Application diagrams1513.14 Printed-circuit board layout2213.15 Response curves for low input mode2213.16 Response curves for high input mode2614. Test information2914.1 Quality information2915. Package outline3016. Soldering3116.1 Introduction to soldering surface mount packages3116.2 Reflow soldering3116.3 Wave soldering3116.4 Manual soldering3216.5 Package related soldering information3217. Revision history3418. Legal information3518.1 Data sheet status3518.2 Definitions3518.3 Disclaimers3518.4 Trademarks3519. Contact information3520. Contents36Taille: 210 koPages: 36Language: EnglishOuvrir le manuel
Manuel D’UtilisationTable des matières1. General description12. Features13. Applications14. Quick reference data25. Ordering information26. Block diagram37. Pinning information47.1 Pinning47.2 Pin description48. Functional description58.1 V/I converters58.2 Output amplifiers58.3 Buffer58.4 Dynamic quiescent controller68.5 Stabilizer68.6 Input logic68.7 Reference69. Internal circuitry710. Limiting values1011. Thermal characteristics1012. Characteristics1013. Application information1113.1 General1113.2 Heatsink design1213.3 Test conditions1213.4 Input configurations1313.5 Standby/mute1413.6 Application1: SE with loudspeaker capacitor1413.7 Application2: SE to buffer (without loudspeaker capacitor)1413.8 Application3: Improved SE to buffer (without loudspeaker capacitor)1413.9 Application4: Bridge tied load mono amplifier1413.10 Application5: Line driver application1413.11 Application6: Line driver application1413.12 Application7: Line driver application1513.13 Application diagrams1513.14 Printed-circuit board layout2213.15 Response curves for low input mode2213.16 Response curves for high input mode2614. Test information2914.1 Quality information2915. Package outline3016. Soldering3116.1 Introduction to soldering surface mount packages3116.2 Reflow soldering3116.3 Wave soldering3116.4 Manual soldering3216.5 Package related soldering information3217. Revision history3418. Legal information3518.1 Data sheet status3518.2 Definitions3518.3 Disclaimers3518.4 Trademarks3519. Contact information3520. Contents36Taille: 210 koPages: 36Language: EnglishOuvrir le manuel