Manuel D’UtilisationTable des matières1 Features32 Applications33 General description34 Quick reference data35 Ordering information36 Block diagram47 Pinning58 Functional description68.1 Power stage68.2 Protection69 Limiting values710 Thermal characteristics711 Quality specification712 DC characteristics813 AC characteristics914 Switching characteristics1015 Test and application information1115.1 SE application1215.2 Package ground connection1215.3 Output power1215.4 Reference design1215.5 Curves measured in reference design1716 Package outline1917 Soldering2117.1 Introduction to soldering through-hole mount packages2117.2 Soldering by dipping or by solder wave2117.3 Manual soldering2117.4 Suitability of through-hole mount IC packages for dipping and wave soldering methods2118 Data sheet status2219 Definitions2220 Disclaimers22Taille: 210 koPages: 23Language: EnglishOuvrir le manuel
Manuel D’UtilisationTable des matières1 Features32 Applications33 General description34 Quick reference data35 Ordering information36 Block diagram47 Pinning58 Functional description68.1 Power stage68.2 Protection69 Limiting values710 Thermal characteristics711 Quality specification712 DC characteristics813 AC characteristics914 Switching characteristics1015 Test and application information1115.1 SE application1215.2 Package ground connection1215.3 Output power1215.4 Reference design1215.5 Curves measured in reference design1716 Package outline1917 Soldering2117.1 Introduction to soldering through-hole mount packages2117.2 Soldering by dipping or by solder wave2117.3 Manual soldering2117.4 Suitability of through-hole mount IC packages for dipping and wave soldering methods2118 Data sheet status2219 Definitions2220 Disclaimers22Taille: 210 koPages: 23Language: EnglishOuvrir le manuel
