Manuel D’UtilisationTable des matières1. General description12. Features13. Applications14. Quick reference data15. Ordering information26. Block diagram27. Pinning information37.1 Pinning37.2 Pin description38. Functional description48.1 Input configuration48.2 Power amplifier58.2.1 Output power measurement58.2.2 Headroom58.3 Mode selection58.3.1 Switch-on and switch-off68.4 Supply Voltage Ripple Rejection (SVRR)68.5 Built-in protection circuits68.5.1 Short-circuit protection68.5.2 Thermal shutdown protection69. Limiting values710. Thermal characteristics711. Static characteristics712. Dynamic characteristics813. Internal circuitry1214. Application information1314.1 Printed-circuit board (PCB)1314.1.1 Layout and grounding1314.1.2 Power supply decoupling1414.2 Thermal behaviour and heatsink calculation1515. Test information1515.1 Quality information1515.2 Test conditions1516. Package outline16SOT243-11617. Soldering1717.1 Introduction to soldering through-hole mount packages1717.2 Soldering by dipping or by solder wave1717.3 Manual soldering1717.4 Package related soldering information1718. Revision history1819. Data sheet status1920. Definitions1921. Disclaimers19Taille: 510 koPages: 21Language: EnglishOuvrir le manuel
Manuel D’UtilisationTable des matières1. General description12. Features13. Applications14. Quick reference data15. Ordering information26. Block diagram27. Pinning information37.1 Pinning37.2 Pin description38. Functional description48.1 Input configuration48.2 Power amplifier58.2.1 Output power measurement58.2.2 Headroom58.3 Mode selection58.3.1 Switch-on and switch-off68.4 Supply Voltage Ripple Rejection (SVRR)68.5 Built-in protection circuits68.5.1 Short-circuit protection68.5.2 Thermal shutdown protection69. Limiting values710. Thermal characteristics711. Static characteristics712. Dynamic characteristics813. Internal circuitry1214. Application information1314.1 Printed-circuit board (PCB)1314.1.1 Layout and grounding1314.1.2 Power supply decoupling1414.2 Thermal behaviour and heatsink calculation1515. Test information1515.1 Quality information1515.2 Test conditions1516. Package outline16SOT243-11617. Soldering1717.1 Introduction to soldering through-hole mount packages1717.2 Soldering by dipping or by solder wave1717.3 Manual soldering1717.4 Package related soldering information1718. Revision history1819. Data sheet status1920. Definitions1921. Disclaimers19Taille: 510 koPages: 21Language: EnglishOuvrir le manuel
