Fiche De Données (LFTVS10-1F3)Table des matièresFigure 1. Pin configuration (bump side)1Figure 2. Device configuration11 Characteristics2Table 1. Absolute maximum ratings (Tamb = 25 C)2Table 2. Electrical characteristics (Tamb = 25 C)2Figure 3. Relative variation of peak pulse power versus initial junction temperature3Figure 4. Peak pulse power versus exponential pulse duration (typical value)3Figure 5. Clamping voltage versus peak pulse current (typical values)3Figure 6. Relative variation of leakage current versus junction temperature (typical values)3Figure 7. Forward voltage drop versus peak forward current (typical values)3Figure 8. Junction capacitance versus line voltage (typical values)3Figure 9. Breakdown voltage versus initial junction temperature (typical value)42 Ordering information scheme4Figure 10. Ordering information scheme43 Package information5Figure 11. Flip Chip dimensions5Figure 12. Footprint recommendations5Figure 13. Marking5Figure 14. Flip Chip tape and reel specifications64 Ordering information6Table 3. Ordering information65 Revision history6Table 4. Document revision history6Taille: 93 koPages: 7Language: EnglishOuvrir le manuel
