Manuel D’UtilisationTable des matièresOverview6GE863 module connections7PIN-OUT7PINS LAYOUT10Hardware Commands11Turning ON the GE863-QUAD/PY11Turning OFF the GE863-QUAD/PY12Hardware shutdown13Hardware Unconditional Reboot13Power Supply15Power Supply Requirements15General Design Rules16Electrical design Guidelines164.2.1.1 + 5V input Source Power Supply Design Guidelines164.2.1.2 + 12V input Source Power Supply Design Guidelines174.2.1.3 Battery Source Power Supply Design Guidelines184.2.1.4 Battery Charge control Circuitry Design Guidelines19Thermal Design Guidelines20Power Supply PCB layout Guidelines21Antenna22GSM Antenna Requirements22GSM Antenna - PCB line Guidelines23GSM Antenna - installation Guidelines23Serial Ports23MODEM SERIAL PORT24MODEM SERIAL PORT 2 (Python Debug)26RS232 level translation265V UART level translation28Audio Section Overview30Microphone Paths Characteristic and Requirements32General Design Rules35Other considerations35Microphone Biasing36Balanced Microphone Biasing36Unbalanced Microphone Biasing37Microphone Buffering39Buffered Balanced Mic39Buffered Unbalanced (Single Ended) Microphone .41OUTPUT LINES (Speaker)44Short description44Output Lines Characteristics45General Design Rules46Noise Filtering46Handset Earphone Design47Hands-Free Earphone (Low Power) Design48Car Kit Speakerphone Design49The Evaluation Kit for Telit Modules EVK250Short Description50EVK2 Audio Lines Characteristics51SIM DESIGN GUIDES52Data Integrity52EMI/EMC52ESD52SIM Supply53SCHEMATIC53LAYOUT5410 General Purpose I/O55Using a GPIO Pad as INPUT55Using a GPIO Pad as OUTPUT55Using the Alarm Output GPIO656Using the Buzzer Output GPIO75611 DAC and ADC section57DAC Converter57Description57Enabling DAC58Low Pass Filter Example58ADC Converter59Description59Using ADC Converter5912 Camera60Transchip Camera60Camera Interface Connectors61EVB for Transchip camera support63Block Diagram for supported cameras64Schematic Diagrams for supported camera65Example usage script for camera6613 Mounting the GE863-QUAD / PY on the Application Board67General67Module Finishing & Dimensions67Recommended foot print for the application69Debug of the GE863 in Production70Stencil70PCB pad Design70Solder paste71GE863-QUAD / PY Solder Reflow72Packing System74Moisture Sensibility7614 Conformity Assessment Issues7715 SAFETY RECOMMANDATIONS7816 Document Change Log79Taille: 1,3 MoPages: 79Language: EnglishOuvrir le manuel