Manuels d'utilisation pour UTStarcom Korea Technologies Ltd. CDMRF101

Table des matières

• CDMRF101

  1
• TCU PHONE MODULE

  1
• INTRODUCTION / OVERVIEW

  6
• MSM 6050 Chipset

  6
• MSM 6050 Features

  6
• IS- Mobile Standards

  7
• Acronym Definitions

  8
• Development Tools for the Phone Module

  8
• LT Box

  8
• MECHANICAL DESCRIPTION

  9
• Phone Module Mechanical Outline

  9
• Phone Module I/O Connector

  9
• I/O Connector Drawing and Supplier Part Number

  9
• I/O Connector Electrical Characteristics

  10
• I/O Connector Pin Assignment

  10
• OPERATING TEMPERATURE AND STORAGE

  13
• Temperature

  13
• Storage Temperature

  13
• Operating Temperature

  13
• ELECTRICAL INTERFACE

  14
• Design Guidelines

  14
• Component Derating

  14
• Ceramic Capacitors / Parallel Plate Capacitors

  14
• Electrolytic Capacitors

  14
• Tantalum Capacitors

  14
• Communication Pins and Unused Pins

  14
• Supply Voltage

  14
• Current Draw

  15
• Inputs/Outputs Logic Levels

  15
• Output Power

  16
• Audio Interface

  16
• PCM Audio

  16
• MSM Timing Parameters

  16
• PCM Sync Timing

  16
• MSM Receive Timing

  17
• MSM Transmitting Timing

  17
• UART Data Interface

  17
• Cellular Antenna Open/Short Sense

  19
• I/O Interface Circuit Diagrams

  20