Intel Xeon 5080 HH80555KH1094M Scheda Tecnica
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HH80555KH1094M
Dual-Core Intel® Xeon® Processor 5000 Series Datasheet
37
Mechanical Specifications
3.2
Processor Component Keepout Zones
The processor may contain components on the substrate that define component
keepout zone requirements. A thermal and mechanical solution design must not intrude
into the required keepout zones. Decoupling capacitors are typically mounted to either
the topside or land-side of the package substrate. See
keepout zone requirements. A thermal and mechanical solution design must not intrude
into the required keepout zones. Decoupling capacitors are typically mounted to either
the topside or land-side of the package substrate. See
for keepout zones.
3.3
Package Loading Specifications
provides dynamic and static load specifications for the processor package.
These mechanical load limits should not be exceeded during heatsink assembly,
mechanical stress testing or standard drop and shipping conditions. The heatsink
attach solutions must not include continuous stress onto the processor with the
exception of a uniform load to maintain the heatsink-to-processor thermal interface.
Also, any mechanical system or component testing should not exceed these limits. The
processor package substrate should not be used as a mechanical reference or load-
bearing surface for thermal or mechanical solutions. Please refer to the Dual-Core
Intel
mechanical stress testing or standard drop and shipping conditions. The heatsink
attach solutions must not include continuous stress onto the processor with the
exception of a uniform load to maintain the heatsink-to-processor thermal interface.
Also, any mechanical system or component testing should not exceed these limits. The
processor package substrate should not be used as a mechanical reference or load-
bearing surface for thermal or mechanical solutions. Please refer to the Dual-Core
Intel
®
Xeon
®
Processor 5000 Series Thermal/Mechanical Design Guidelines for further
details.
Notes:
1.
These specifications apply to uniform compressive loading in a direction perpendicular to the IHS top
surface.
2.
This is the minimum and maximum static force that can be applied by the heatsink and retention solution
to maintain the heatsink and processor interface.
3.
Loading limits are for the LGA771 socket.
4.
Dynamic compressive load applies to all board thickness.
5.
Dynamic loading is defined as an 11 ms duration average load superimposed on the static load
requirement.
6.
Test condition used a heatsink mass of 1 lbm with 50 g acceleration measured at heatsink mass. The
dynamic portion of this specification in the product application can have flexibility in specific values, but the
ultimate product of mass times acceleration should not exceed this dynamic load.
7.
Transient bend is defined as the transient board deflection during manufacturing such as board assembly
and system integration. It is a relatively slow bending event compared to shock and vibration tests.
8.
For more information on the transient bend limits, please refer to the MAS document entitled
Manufacturing with Intel
®
Components using 771-land LGA Package that Interfaces with the Motherboard
via a LGA771 Socket.
9.
Refer to the Dual-Core Intel
®
Xeon
®
Processor 5000 Series Thermal/Mechanical Design Guidelines for
information on heatsink clip load metrology.
Table 3-1.
Package Loading Specifications
Parameter
Board
Thickness
R
Min
Max
Unit
Notes
Static
Compressive Load
Compressive Load
Apply for all
board thickness
from 1.57 mm
(0.062”) to
2.54 mm
(0.100”)
25mm
<R<
45mm
<R<
45mm
80
18
18
133
30
N
lbf
1, 2, 3, 9,
10, 11,
12, 13
R>45mm
80
18
18
311
70
N
lbf
Dynamic
Compressive Load
NA
NA
NA
311 N (max static
compressive load) +
222 N dynamic loading
70 lbf (max static
compressive load) +
50 lbf dynamic loading
N
lbf
1, 3, 4, 5,
6
Transient Bend
Limits
1.57 mm
0.062”
NA
NA
750
µε
1,3,7,8
2.16 mm
0.085”
700
2.54 mm
0.100”
650