Intel DG35EC Manuale Utente

70 

The electronics industry is transitioning to European Union (EU) Restriction of 
Hazardous Substances (RoHS)-compliant products.  The RoHS legislation restricts the 
use of six materials.  One of these restricted materials is lead.  Lead is the most 
common and problematic of the RoHS restricted materials.   

There are exemptions in RoHS that allow the use of lead in some very limited locations 
in electronic products.  Maximum lead concentration values have been established for 
RoHS-compliant electronic products that allow up to 1000 ppm of lead.    

Lead-free/Pb-free is a nickname that is often used (or misused) for RoHS-compliant 
products.  In this case, the term "Lead-free/Pb-free" means that lead has been 
removed where required by the RoHS legislation but still may exist as an impurity 
below 1000 ppm. 

The term "Lead-free 2LI/Pb-free 2LI" means lead-free second level interconnect (2LI).  
The balls, leads, or pads used to connect the component to a printed circuit board are 
lead-free, but the first level interconnect (FLI) is not lead-free.  The use of lead in the 
FLI is acceptable because of the RoHS "flip chip" or "die bump" interconnect 
exemption. 

Desktop Board DG35EC is a lead-free second level interconnect product.  Table 17 
shows the lead-free second level interconnect marks as they appear on the board and 
accompanying collateral.  These marks are based on JEDEC standard J-STD-609, 
“Marking and Labeling of Components, PCBs and PCBAs to Identify Lead, Lead Free 
and Other Attributes.” 

For more information concerning Intel’s lead-free initiatives, refer to 

.