Lenovo Intel Xeon E5520 67Y0011 Manuale Utente
Codici prodotto
67Y0011
Thermal Solutions
38
Thermal/Mechanical Design Guide
Compliance to Profile A ensures that no measurable performance loss will occur due to
TCC activation. It is expected that TCC would only be activated for very brief periods of
time when running a worst-case real world application in a worst-case thermal
condition. A worst-case real world application is a commercially available, useful
application which dissipates power above TDP for a thermally relevant timeframe. One
example of a worst-case thermal condition is when the processor local ambient
temperature is above the y-axis intercept for Profile A.
TCC activation. It is expected that TCC would only be activated for very brief periods of
time when running a worst-case real world application in a worst-case thermal
condition. A worst-case real world application is a commercially available, useful
application which dissipates power above TDP for a thermally relevant timeframe. One
example of a worst-case thermal condition is when the processor local ambient
temperature is above the y-axis intercept for Profile A.
5.6
Thermal Features
More information regarding processor thermal features is contained in the appropriate
Datasheet.
Datasheet.
Figure 5-5. Dual Thermal Profile
POWER
TEMPERATURE
40C
0W
TDP
T
CASE
_MAX_A
T
CASE
_MAX_B
1U Heatsink
2U Heatsink