Intel L5618 AT80614005079AB Manuale Utente

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Intel
®
 Xeon
®
 Processor 5600 Series Datasheet Volume 1
167
Boxed Processor Specifications
9
Boxed Processor Specifications
9.1
Introduction
Intel boxed processors are intended for system integrators who build systems from 
components available through distribution channels. The Intel Xeon processor 5600 
series will be offered as an Intel boxed processor, however the thermal solution will be 
sold separately.
Intel Xeon processor 5600 series boxed processors will not include a thermal solution in 
the box. Intel will offer boxed thermal solutions separately through the same 
distribution channels. Please referenc
 for more details on 
Boxed Processor Thermal Solutions.
9.1.1
Available Boxed Thermal Solution Configurations
Intel will offer three different Boxed Heat Sink solutions to support Boxed Processors.
• Boxed  Intel Thermal Solution STS100C (Order Code BXSTS100C): A Passive / 
Active Combination Heat Sink Solution that is intended for processors with a TDP 
up to 130W in a pedestal or 2U+ chassis with appropriate ducting.
• Boxed  Intel Thermal Solution STS100A (Order Code BXSTS100A): An Active Heat 
Sink Solution that is intended for processors with a TDP of 80W or lower in pedestal 
chassis.
• Boxed  Intel Thermal Solution STS100P (Order Code BXSTS100P): A 25.5 mm Tall 
Passive Heat Sink Solution that is intended for processors with a TDP of 95W or 
lower in Blades, 1U, or 2U chassis with appropriate ducting.
9.1.2
Intel
® 
Thermal Solution STS100C 
(Passive/Active Combination Heat Sink Solution)
The STS100C, based on a 2U passive heat sink with a removable fan, is intended for 
use with processors with TDP’s up to 130W. This heat pipe-based solution is intended to 
be used as either a passive heat sink in a 2U or larger chassis, or as an active heat sink 
for pedestal chassis. 
 are representations of the heat sink 
solution. Although the active combination solution with the removable fan installed 
mechanically fits into a 2U keepout, its use has not been validated in that 
configuration.
The STS100C in the active fan configuration is primarily designed to be used in a 
pedestal chassis where sufficient air inlet space is present. The STS100C with the fan 
removed, as with any passive thermal solution, will require the use of chassis ducting 
and are targeted for use in rack mount or ducted pedestal servers. The retention 
solution used for these products is called Unified Retention System (URS).