Intel L5618 AT80614005079AB Manuale Utente

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AT80614005079AB
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Intel
®
 Xeon
®
 Processor 5600 Series Datasheet Volume 1
183
Boxed Processor Specifications
Processors with a TDP of 80 W or lower must provide a minimum airflow of 9.7 CFM at 
0.20 in. H2O (16.5 m3/hr at 49.8 Pa) of flow impedance.  It is assumed that a TLA of 
49°C is met for these processor installations.  This requires a chassis design to limit the 
TRISE at or below 14°C with an external ambient temperature of 35°C. 
Note:
lease refer to the Intel® Xeon® Processor 5500/5600 Series Thermal / Mechanical 
Design Guide for detailed mechanical drawings of the STS100P.
9.4
Boxed Processor Contents
The Boxed Processor and Boxed Thermal Solution contents are outlined below.
Boxed Processor
• Intel Xeon processor 5600 series
 processor
• Installation and warranty manual
• Intel  Inside  Logo
Boxed Thermal Solution
• Heat sink assembly solution
• Thermal interface material (pre-applied on heat sink, if included)
• Installation and warranty manual
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