Intel BX80525KY500512 Manuale Utente
Pentium
®
III Xeon™ Processor at 500 and 550 MHz
Datasheet
53
NOTES
6. Interface agent suggestions: ShinEtsu* G749 or Thermoset* TC330; Dispense volume adequate to ensure
required minimum area of coverage when cooling solution is attached. Areas A and C are suggested for the
512-Kbyte L2 cache product and areas A, B, and D for the 1-Mbyte and 2-Mbyte L2 cache products.
Recommended cooling solution mating surface flatness is no greater than 0.007" or flatter.
512-Kbyte L2 cache product and areas A, B, and D for the 1-Mbyte and 2-Mbyte L2 cache products.
Recommended cooling solution mating surface flatness is no greater than 0.007" or flatter.
7. Temperature of the entire thermal plate surface not to exceed specification. Use any combination of interface
agent, cooling solution, flatness condition, etc., to ensure this condition is met. Thermocouple measurement
locations are the expected high temperature locations without external heat source influence. Ensure that
external heat sources do not cause a violation of T
locations are the expected high temperature locations without external heat source influence. Ensure that
external heat sources do not cause a violation of T
PLATE
requirements
5.2.3
Measurements for Thermal Specifications
5.2.3.1
Thermal Plate Temperature Measurement
To ensure functional and reliable processor operation, the processor’s thermal plate temperature
(T
(T
PLATE
) must be maintained at or below the maximum T
PLATE
and at or above the minimum
T
PLATE
specified in
. Power from the processor core and L2 cache is transferred to the
thermal plate at 2 locations on the 512-Kbyte L2 cache product and 3 locations on the 1-Mbyte and
Figure 20. Interface Agent Dispensing Areas and Thermal Plate Temperature Measurement
Points
1.960
.980