Intel Xeon 7130N LF80550KF0878M Scheda Tecnica

Codici prodotto

LF80550KF0878M

Dual-Core Intel

Xeon

Processor 7000 Series Datasheet

Contents

Introduction....................................................................................................................... 11

1.1

Terminology......................................................................................................... 12

1.2

Reference Documents......................................................................................... 14

1.3

State of Data ....................................................................................................... 14

Electrical Specifications.................................................................................................... 15

2.1

Front Side Bus and GTLREF .............................................................................. 15
2.1.1

Front Side Bus Clock and Processor Clocking....................................... 15

2.1.2

Front Side Bus Clock Select (BSEL[1:0]) ............................................... 16

2.1.3

Phase Lock Loop (PLL) Power and Filter............................................... 17

2.2

Voltage Identification (VID).................................................................................. 17

2.3

Reserved, Unused, and TESTHI Pins................................................................. 20

2.4

Mixing Processors ............................................................................................... 20

2.5

Front Side Bus Signal Groups............................................................................. 21

2.6

GTL+ Asynchronous Signals and AGTL + Asynchronous Signals...................... 22

2.7

Test Access Port (TAP) Connection.................................................................... 23

2.8

Absolute Maximum and Minimum Ratings .......................................................... 23

2.9

Processor DC Specifications............................................................................... 24
2.9.1

Flexible Motherboard (FMB) Guidelines................................................. 24

2.9.2

Vcc Overshoot Specification .................................................................. 28

Mechanical Specifications ................................................................................................ 33

3.1

Package Mechanical Drawing ............................................................................. 33

3.2

Processor Component Keepout Zones ............................................................... 36

3.3

Package Loading Specifications ......................................................................... 36

3.4

Package Handling Guidelines ............................................................................. 37

3.5

Package Insertion Specifications ........................................................................ 37

3.6

Processor Mass Specifications ........................................................................... 37

3.7

Processor Materials............................................................................................. 37

3.8

Processor Markings............................................................................................. 38

3.9

Processor Pin-Out Coordinates........................................................................... 39

Pin Listing......................................................................................................................... 41

4.1

Dual-Core Intel Xeon Processor 7000 Series Pin Assignments.......................... 41
4.1.1

Pin Listing by Pin Name ......................................................................... 41

4.1.2

Pin Listing by Pin Number ...................................................................... 50

Signal Definitions.............................................................................................................. 59

5.1

Signal Definitions................................................................................................. 59

Thermal Specifications ..................................................................................................... 67

6.1

Package Thermal Specifications ......................................................................... 67
6.1.1

Thermal Specifications ........................................................................... 67

6.1.2

Thermal Metrology ................................................................................. 70

6.2

Processor Thermal Features............................................................................... 70
6.2.1

Thermal Monitor ..................................................................................... 70