Intel D525 AU80610006225AA Manuale Utente

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AU80610006225AA
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Datasheet
61
Thermal Specifications and Design Considerations
When calculating a temperature based on the thermal diode measurements, a number 
of parameters must be either measured or assumed. Most devices measure the diode 
ideality and assume a series resistance and ideality trim value, although are capable of 
also measuring the series resistance. Calculating the temperature is then accomplished 
using the equations listed under 
. In most sensing devices, an expected 
value for the diode ideality is designed-in to the temperature calculation equation. If 
the designer of the temperature sensing device assumes a perfect diode, the ideality 
value (also called n
trim
) will be 1.000. Given that most diodes are not perfect, the 
designers usually select an n
trim
 value that more closely matches the behavior of the 
diodes in the processor. If the processor diode ideality deviates from that of the n
trim
each calculated temperature will be offset by a fixed amount. This temperature offset 
can be calculated with the equation:
T
error(nf)
 = T
measured
 * (1 - n
actual
/n
trim
)
where T
error(nf)
 is the offset in degrees C, T
measured
 is in Kelvin, n
actual
 is the 
measured ideality of the diode, and n
trim
 is the diode ideality assumed by the 
temperature sensing device.
7.1.2
Intel® Thermal Monitor
The Intel Thermal Monitor helps control the processor temperature by activating the 
TCC (Thermal Control Circuit) when the processor silicon reaches its maximum 
operating temperature. The temperature at which the Intel Thermal Monitor activates 
the TCC is not user configurable. Bus traffic is snooped in the normal manner and 
interrupt requests are latched (and serviced during the time that the clocks are on) 
while the TCC is active.
With a properly designed and characterized thermal solution, it is anticipated that the 
TCC would only be activated for very short periods of time when running the most 
power intensive applications. The processor performance impact due to these brief 
periods of TCC activation is expected to be minor and hence not detectable. An under- 
designed thermal solution that is not able to prevent excessive activation of the TCC in 
the anticipated ambient environment may cause a noticeable performance loss and 
may affect the long-term reliability of the processor. In addition, a thermal solution that 
is significantly under designed may not be capable of cooling the processor even when 
the TCC is active continuously.
The Intel Thermal Monitor controls the processor temperature by modulating (starting 
and stopping) the processor core clocks when the processor silicon reaches its 
maximum operating temperature. The Intel Thermal Monitor uses two modes to 
activate the TCC: automatic mode and on-demand mode. If both modes are activated, 
automatic mode takes precedence. 
Intel Thermal Monitor 1 (TM1) mode is selected by writing values to the MSRs of the 
processor. After automatic mode is enabled, the TCC will activate only when the 
internal die temperature reaches the maximum allowed value for operation.