Intel 2 Duo T9300 EC80576GG0606M Manuale Utente
Codici prodotto
EC80576GG0606M
Datasheet
71
Thermal Specifications
5
Thermal Specifications
Maintaining the proper thermal environment is key to reliable, long-term system
operation. A complete thermal solution includes both component and system-level
thermal management features. To allow for the optimal operation and long-term
reliability of Intel processor-based systems, the system/processor thermal solution
should be designed so the processor remains within the minimum and maximum
junction temperature (T
J
) specifications at the corresponding thermal design power
(TDP) value listed in
. Analysis indicates that real applications are unlikely to
cause the processor to consume the theoretical maximum power dissipation for
sustained time periods.
NOTES:
1.
1.
The TDP specification should be used to design the processor thermal solution. The TDP is
not the maximum theoretical power the processor can generate.
not the maximum theoretical power the processor can generate.
2.
Not 100% tested. These power specifications are determined by characterization of the
processor currents at higher temperatures and extrapolating the values for the
temperature indicated.
processor currents at higher temperatures and extrapolating the values for the
temperature indicated.
3.
As measured by the activation of the on-die Intel Thermal Monitor. The Intel Thermal
Monitor’s automatic mode is used to indicate that the maximum T
Monitor’s automatic mode is used to indicate that the maximum T
J
has been reached.
Refer to
for details.
4.
The Intel Thermal Monitor automatic mode must be enabled for the processor to operate
within specifications.
within specifications.
5.
Processor TDP requirements in Intel Dynamic Acceleration Technology mode is less than
TDP in HFM.
TDP in HFM.
6.
At Tj of 105
o
C
7.
At Tj of 50
o
C
8.
At Tj of 35
o
C
Table 15.
Power Specifications for the Extreme Edition Processor
Symbol
Processor
Number
Core Frequency & Voltage
Thermal Design
Power
Unit
Notes
TDP
X9000
2.8 GHz & V
CCHFM
1.2 GHz & V
CCLFM
0.8 GHz & V
CCSLFM
44
29
22
29
22
W
1, 4,
5, 6
Symbol
Parameter
Min Typ Max
Unit
Notes
P
AH,
P
SGNT
Auto Halt, Stop Grant Power
at V
at V
CCHFM
at V
CCSLFM
—
—
17.1
7.4
W
2, 5, 7
P
SLP
Sleep Power
at V
at V
CCHFM
at V
CCSLFM
—
—
16.1
7.1
W
2, 5, 7
P
DSLP
Deep Sleep Power
at V
at V
CCHFM
at V
CCSLFM
—
—
7.5
4.2
4.2
W
2, 5, 8
P
DPRSLP
Deeper Sleep Power
—
—
1.9
W
2,8
P
DC4
Intel® Enhanced Deeper Sleep State Power
—
—
1.7
W
2,8
P
C6
Deep Power-Down Technology Power
—
—
1.3
W
2, 8
T
J
Junction Temperature
0
—
105
°C
3, 4