Intel 220 LE80557RE009512 Scheda Tecnica

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LE80557RE009512
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Electrical Specifications
30
Datasheet
3.8.3
Processor DC Specifications
The processor DC specifications in this section are defined at the processor core (pads), 
unless otherwise stated. All specifications apply to all frequencies and cache sizes 
unless otherwise stated. 
1.
Unless otherwise noted, all specifications in this table apply to all processor frequencies.
2.
V
IL
 is defined as the voltage range at a receiving agent that will be interpreted as a logical 
low value.
3.
V
IH
 is defined as the voltage range at a receiving agent that will be interpreted as a logical 
high value.
4.
V
IH
 and V
OH
 may experience excursions above V
CCP
5.
The V
CCP
 referred to in these specifications is the instantaneous V
CCP
.
6.
Leakage to V
SS
 with pin held at V
CCP
.
7.
Leakage to V
CCP
 with pin held at 300 mV.
NOTES:
1.
Measured at 0.2 V.
2.
V
OH
 is determined by value of the external pul-lup resistor to V
CCP
3.
For Vin between 0 V and V
OH
.
4.
C
PAD
 includes die capacitance only. No package parasitics are included.
Table 11.
GTL+ Signal Group DC Specifications
Symbol
Parameter
Min
Max
Unit
Notes
1
V
IL
Input Low Voltage
-0.10
GTLREF – 0.10
V
2, 5
V
IH
Input High Voltage
GTLREF + 0.10
V
CCP 
+ 0.10
V
3, 4, 5
V
OH
Output High Voltage
V
CCP 
– 0.10
V
CCP
V
4,  5
I
OL
Output Low Current
N/A
V
CCP_MAX
/
[(R
TT_MIN
)+(R
ON_MIN
)]
A
-
I
LI
Input Leakage Current
N/A
± 100
µA
6
I
LO
Output Leakage Current
N/A
± 100
µA
7
R
ON
Buffer On Resistance
10
13
Ω
Table 12.
Open Drain and TAP Output Signal Group DC Specifications
Symbol
Parameter
Min
Typ
Max
Unit
Notes
1
V
OL
Output Low Voltage
0
0.20
V
I
OL
Output Low Current
16
50
mA
1
I
LO
Output Leakage Current
±200
µA
3
C
PAD
Pad Capacitance
1.9
2.2
2.45
pF
4