Intel E7310 LF80565QH0254M Scheda Tecnica
Codici prodotto
LF80565QH0254M
Document Number: 318080-002
57
Mechanical Specifications
3
Mechanical Specifications
The Intel
®
Xeon
®
Processor 7200 Series and 7300 Series is packaged in a FC-mPGA6
package that interfaces with the motherboard via a mPGA604 socket. The package
consists of two processor dies mounted on a substrate pin-carrier. An IHS is attached
to the package substrate and die and serves as the mating surface for processor
component thermal solutions, such as a heatsink.
consists of two processor dies mounted on a substrate pin-carrier. An IHS is attached
to the package substrate and die and serves as the mating surface for processor
component thermal solutions, such as a heatsink.
shows a sketch of the
processor package components and how they are assembled together. Refer to the
mPGA604 Socket Design Guidelines for complete details on the mPGA604 socket.
mPGA604 Socket Design Guidelines for complete details on the mPGA604 socket.
The package components shown in
1. IHS
2. Processor die
3. FC-mPGA6 package
4. Pin-side capacitors
5. Package pin
2. Processor die
3. FC-mPGA6 package
4. Pin-side capacitors
5. Package pin
Note:
is not to scale and is for reference only. The mPGA604 socket is not shown.
3.1
Package Mechanical Drawing
The package mechanical drawings are shown in
. The
drawings include dimensions necessary to design a thermal solution for the processor.
These dimensions include:
These dimensions include:
1. Package reference with tolerances (total height, length, width, etc.)
2. IHS parallelism and tilt
3. Pin dimensions
4. Top-side and back-side component keepout dimensions
5. Reference datums
2. IHS parallelism and tilt
3. Pin dimensions
4. Top-side and back-side component keepout dimensions
5. Reference datums
All drawing dimension are in mm [in].
Figure 3-1. Processor Package Assembly Sketch