Manualsbrain.com
it
English
Deutsch
Español
Français
Português
Русский
조선말, 한국어
日本語
中文
Manuali
Marche
Intel
E8190
Manuale Utente
Intel E8190 EU80570PJ0676MN Manuale Utente
Codici prodotto
EU80570PJ0676MN
Scarica
Like
Schermo intero
Standard
Pagina
di
128
Vai
4
Thermal and Mechanical Design Guidelines
4.2.6
System Considerations .............................................................. 37
4.2.7
Operating System and Application Software Considerations ........... 38
4.2.8
THERMTRIP# Signal .................................................................. 38
4.2.9
Cooling System Failure Warning ................................................. 38
4.2.10
Digital Thermal Sensor .............................................................. 39
4.2.11
Platform Environmental Control Interface (PECI) .......................... 40
5
Balanced Technology Extended (BTX) Thermal/Mechanical Design Information ......... 41
5.1
Overview of the BTX Reference Design ..................................................... 41
5.1.1
Target Heatsink Performance ..................................................... 41
5.1.2
Acoustics ................................................................................. 42
5.1.3
Effective Fan Curve ................................................................... 43
5.1.4
Voltage Regulator Thermal Management ...................................... 44
5.1.5
Altitude ................................................................................... 45
5.1.6
Reference Heatsink Thermal Validation ........................................ 45
5.2
Environmental Reliability Testing ............................................................. 45
5.2.1
Structural Reliability Testing ...................................................... 45
5.2.1.1
Random Vibration Test Procedure ................................ 45
5.2.1.2
Shock Test Procedure ................................................. 46
5.2.2
Power Cycling .......................................................................... 47
5.2.3
Recommended BIOS/CPU/Memory Test Procedures ...................... 48
5.3
Material and Recycling Requirements........................................................ 48
5.4
Safety Requirements .............................................................................. 49
5.5
Geometric Envelope for Intel Reference BTX Thermal Module Assembly ........ 49
5.6
Preload and TMA Stiffness ....................................................................... 50
5.6.1
Structural Design Strategy ......................................................... 50
5.6.2
TMA Preload verse Stiffness ....................................................... 50
6
ATX Thermal/Mechanical Design Information ........................................................ 53
6.1
ATX Reference Design Requirements ........................................................ 53
6.2
Validation Results for Reference Design .................................................... 55
6.2.1
Heatsink Performance ............................................................... 55
6.2.2
Acoustics ................................................................................. 56
6.2.3
Altitude ................................................................................... 56
6.2.4
Heatsink Thermal Validation ....................................................... 57
6.3
Environmental Reliability Testing ............................................................. 57
6.3.1
Structural Reliability Testing ...................................................... 57
6.3.1.1
Random Vibration Test Procedure ................................ 57
6.3.1.2
Shock Test Procedure ................................................. 58
6.3.2
Power Cycling .......................................................................... 59
6.3.3
Recommended BIOS/CPU/Memory Test Procedures ...................... 60
6.4
Material and Recycling Requirements........................................................ 60
6.5
Safety Requirements .............................................................................. 61
6.6
Geometric Envelope for Intel Reference ATX Thermal Mechanical Design ...... 61
6.7
Reference Attach Mechanism ................................................................... 62
6.7.1
Structural Design Strategy ......................................................... 62
6.7.2
Mechanical Interface to the Reference Attach Mechanism .............. 63
7
Intel
®
Quiet System Technology (Intel
®
QST) ...................................................... 65
7.1
Intel
®
QST Algorithm .............................................................................. 65
7.1.1
Output Weighting Matrix ............................................................ 66
7.1.2
Proportional-Integral-Derivative (PID) ......................................... 66
7.2
Board and System Implementation of Intel
®
QST ....................................... 68
Prec
Successivo
1
2
3
4
5
6
…
128
