Intel SU2300 AV80577UG0091ML Scheda Tecnica

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AV80577UG0091ML
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Datasheet
83
Thermal Specifications and Design Considerations
5
Thermal Specifications and 
Design Considerations
Maintaining the proper thermal environment is key to reliable, long-term system 
operation. A complete thermal solution includes both component and system level 
thermal management features. The system/processor thermal solution should be 
designed so that the processor remains within the minimum and maximum junction 
temperature (Tj) specifications at the corresponding thermal design power (TDP) value 
listed in 
 through 
Caution:
Operating the processor outside these limits may result in permanent damage to the 
processor and potentially other components in the system. 
NOTES:
1.
The TDP specification should be used to design the processor thermal solution. The TDP is not the 
maximum theoretical power the processor can generate. 
2.
Not 100% tested. These power specifications are determined by characterization of the processor currents 
at higher temperatures and extrapolating the values for the temperature indicated.
Table 23.
Power Specifications for the 3x00 Celeron Processors
Symbol
Processor 
Number
Core Frequency & Voltage
Thermal Design 
Power
Unit
Notes
TDP
T1600
1.66 GHz
35
W
1, 4, 5, 6, 9
TDP
T1700
1.83 GHz
35
W
1, 4, 5, 6, 9
Symbol
Parameter
Min
Typ
Max
Unit
P
AH,
P
SGNT
Auto Halt, Stop Grant Power at HFM V
CC
13.9
W
2, 5, 7
P
SLP
Sleep Power at V
CC
13.1
W
2, 5, 7
P
DSLP
Deep Sleep Power at V
CC
5.5
W
2, 5, 8
T
J
Junction Temperature
0
105
°C
3,  4
Table 24.
Power Specifications for the Intel Celeron Dual-Core Processor - Standard 
Voltage
Symbol
Processor 
Number
Core Frequency & Voltage
Thermal Design 
Power
Unit
Notes
TDP
T1600
1.66 GHz
35
W
1, 4, 5, 6, 9
TDP
T1700
1.83 GHz
35
W
1, 4, 5, 6, 9
Symbol
Parameter
Min
Typ
Max
Unit
P
AH,
P
SGNT
Auto Halt, Stop Grant Power at HFM V
CC
13.5
W
2, 5, 7
P
SLP
Sleep Power at V
CC
12.9
W
2, 5, 7
P
DSLP
Deep Sleep Power at V
CC
7.7
W
2, 5, 8
T
J
Junction Temperature
0
100
°C
3,  4