Intel i7-660LM CN80617004857AA Manuale Utente

Datasheet

53

A multi-chip package (MCP) processor requires a thermal solution to maintain 

temperatures of the processor core and graphics/memory core within operating limits. 

A complete thermal solution provides both the component-level and the system-level 

thermal management. To allow for the optimal operation and long-term reliability of 

Intel processor-based systems, the system/processor thermal solution should be 

designed so that the processor:

• Remains below the maximum junction temperature (T

j,Max

) specification at the 

maximum thermal design power (TDP).

• Conforms to system constraints, such as system acoustics, system skin-

temperatures, and exhaust-temperature requirements.

Thermal specifications given in this chapter are on the component and package level 

and apply specifically to the processor. 

Operating the processor outside the specified limits may result in permanent damage 

to the processor and potentially other components in the system.

The TDP of an MCP processor is the expected maximum power from each of its 

components (processor core and integrated graphics and memory controller) while 

running realistic, worst case applications (TDP applications). TDP is not the absolute 

worst case power of each component. It could, for example, be exceeded under a 

synthetic worst case condition or under short power spikes. In production, a range of 

power is to be expected from the components due to the natural variation in the 

manufacturing process. The thermal solution, at a minimum, needs to ensure that the 

junction temperatures of both components do not exceed the maximum junction 

temperature (T

j,max

) limit while running TDP applications.

Typical workloads are not intensive enough to push both the processor core and the 

integrated graphics and memory controller towards their TDP limit simultaneously. As 

such, the opportunity exists to share thermal power between the components and 

boost the performance of either the processor core or integrated graphics and memory 

controller on demand. This intelligent power sharing capability is implemented by Intel 

Turbo Boost Technology Driver. When enabled, the processor core or the integrated 

graphics and memory controller can increase its thermal power consumption above its 

own component TDP limit. However, the sum of component thermal powers adhere to 

the specified MCP thermal power limit.

Intel Turbo Boost Technology and Graphics Dynamic Frequency are implemented via a 

combination of Intel silicon capabilities, graphics driver and the Intel Turbo Boost 

Technology driver. If Intel provides Intel Turbo Boost Technology support or Graphics 

Dynamic Frequency support for the target operating system that is shipped with the 

customer’s platform and Intel Turbo Boost technology or Graphics Dynamic Frequency 

is enabled, the Intel Turbo Boost Technology driver and graphics driver must be 

installed and operating to keep the product operating within specification limits.

The TURBO_POWER_CURRENT_LIMIT MSR is exclusively reserved for Intel Turbo 

Technology Driver use. Under no circumstances should this value be altered from the