HP gx466 Manuale Utente

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User’s Manual 
ECM-5510 User’s Manual 
 
19
 
1.6.5 
Winbond W83627HF-AW LPC Super I/O 
The Winbond W83627F/HF is made to fully comply with Microsoft PC98 and PC99 
Hardware Design Guide. Moreover, W83627F/HF is made to meet the specification of 
PC98/PC99’s requirement in the power management: ACPI and DPM (Device Power 
Management). Super I/O chip provides features as the following: 
•  Meet LPC Spec. 1.0 
•  Support LDRQ# (LPC DMA), SERIRQ (serial IRQ) 
•  Include all features of Winbond I/O W83977TF and W83977EF 
•  Integrate Hardware Monitor functions 
•  Compliant with Microsoft PC98/PC99 Hardware Design Guide. 
•  Support DPM (Device Power Management), ACPI 
• Programmable configuration settings 
•  Single 24 or 48 MHz clock input 
1.6.6 
Winbond W83977EF ISA Super I/O 
The Winbond W83627F/HF is made to fully comply with Microsoft PC98 Hardware Design 
Guide. Moreover, W83627F/HF is made to meet the specification of PC98’s requirement in 
the power management: ACPI and DPM (Device Power Management). Super I/O chip 
provides features as the following: 
•  Plug & Play 1.0A compatible 
•  Supports 12 IRQs, 4 DMA channels, full 16-bit address decoding 
•  Capable of ISA Bus IRQ Sharing 
•  Compliant with Microsoft PC98 Hardware Design Guide 
•  Supports DPM (Device Power Management), ACPI 
•  Reports ACPI status interrupt by SCI# signal issued from any of the 12 IRQs pins or 
GPIO xx 
• Programmable configuration settings 
•  Single 24/48 Mhz clock input