HP pavilion dv6500 6600 6700 Manuale Di Servizio

Remove the fan/heat sink assembly (4).

Due to the adhesive quality of the thermal paste and thermal pads located between the

fan/heat sink assembly and system board components, it may be necessary to move the fan/heat

sink assembly from side to side to detach the assembly.

The thermal material must be thoroughly cleaned from the surfaces of the fan/heat sink

assembly (1) and (2), the processor (3), and the system board component (4) each time the fan/heat

sink assembly is removed. Thermal material must be installed on all surfaces before the fan/heat sink

assembly is reinstalled. Thermal material is included with all fan/heat sink assembly, system board, and

processor spare part kits.

Reverse this procedure to install the fan/heat sink assembly.

All processor spare part kits include thermal paste.

2.20-GHz processor (4-MB L2 cache, 800-MHz FSB)

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88 Chapter 4   Removal and replacement procedures