HP 457626-001 Manuale Utente

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Contents 36 
 
 
 
Removal and Replacement Procedures 
This chapter provides subassembly/module-level removal and replacement procedures for the HP 
ProLiant DL165 G5 server. 
Review the specifications of a new component before installing it to make sure it is compatible with 
the server. When you integrate new components into the system, record its model and serial number, 
and any other pertinent information for future reference. After completing any removal or replacement 
procedure, run the diagnostics program to verify that all components operate properly. 
 
 
NOTE: The figures used in this chapter to illustrate procedural steps are labeled numerically (i.e., 1, 
2…). When these figures are used in substep items, the alphabetically labeled instructions 
correspond to the numbered labels on the related figure (i.e., label 1 corresponds to step a, label 2 
corresponds to step b, etc.). The procedures described in this section assume that the server is out of 
the rack and is positioned on a flat, stable surface. 
Hardware Configuration Tools  
You will need the following tools: 
 
T-10/T-15 screwdrivers  
 
Flat-blade screwdriver 
The following references and software tools will assist with the hardware configuration:  
 
HP ProLiant
 
DL165 G5 Server Support CD 
 
IPMI Event Log 
 
Diagnostics Software 
Hardware Configuration Information 
Electrostatic Discharge Information 
An electrostatic discharge (ESD) can damage static-sensitive devices or microcircuitry. Proper 
packaging and grounding techniques are necessary precautions to prevent damage. To prevent 
electrostatic damage, observe the following precautions: 
 
Transport products in static-safe containers such as conductive tubes, bags, or boxes. 
 
Keep electrostatic-sensitive parts in their containers until they arrive at static-free stations. 
 
Cover workstations with approved static-dissipating material. Use a wrist strap connected to the 
work surface, and properly grounded (earthed) tools and equipment. 
 
Keep work area free of nonconductive materials, such as ordinary plastic assembly aids and 
foam packing. 
 
Make sure that you are always properly grounded (earthed) when touching a static-sensitive 
component or assembly. 
 
Avoid touching pins, leads, or circuitry. 
 
Always place drives with the Printed Circuit Board (PCB) assembly-side down.