NEC uPD75P3116 Manuale Utente

PD75P3116

Data Sheet U11369EJ3V0DS

12. RECOMMENDED SOLDERING CONDITIONS

The

PD75P3116 should be soldered and mounted under the conditions recommended in the table below.

For details of recommended soldering conditions, refer to the information document Semiconductor Device

Mounting Technology Manual (C10535E).

For soldering methods and conditions other than those recommended below, contact an NEC Sales representative.

Table 12-1. Surface Mounting Type Soldering Conditions (1/2)

(1)

PD75P3116GC-AB8: 64-pin plastic QFP (14

14)

Soldering

Soldering Conditions

Recommended

Method

Condition Symbol

Infrared reflow

Package peak temperature: 235

C, Time: 30 seconds max. (at 210

C or higher),

IR35-00-3

Count: Three times or less

VPS

Package peak temperature: 215

C, Time: 40 seconds max. (at 200

C or higher),

VP15-00-3

Count: Three times or less

Wave soldering

Solder bath temperature: 260

C max., Time: 10 seconds max., Count: Once,

WS60-00-1

Preheating temperature: 120

C max. (package surface temperature)

Partial heating

Pin temperature: 300

C max., Time: 3 seconds max. (per pin row)

—

Caution

Do not use different soldering methods together (except for partial heating).

(2)

PD75P3116GK-8A8: 64-pin plastic LQFP (12

12)

Soldering

Soldering Conditions

Recommended

Method

Condition Symbol

Infrared reflow

Package peak temperature: 235

C, Time: 30 seconds max. (at 210

C or higher),

IR35-107-2

Count: Twice or less
Exposure limit: 7 days

Note

(after that, prebake at 125

C for 10 hours)

VPS

Package peak temperature: 215

C, Time: 40 seconds max. (at 200

C or higher),

VP15-107-2

Count: Twice or less
Exposure limit: 7 days

Note

(after that, prebake at 125

C for 10 hours)

Wave soldering

Solder bath temperature: 260

C max., Time: 10 seconds max., Count: Once,

WS 60-107-1

Preheating temperature: 120

C max. (package surface temperature)

Exposure limit: 7 days

Note

(after that, prebake at 125

C for 10 hours)

Partial heating

Pin temperature: 300

C max., Time: 3 seconds max. (per pin row)

—

Note After opening the dry pack, store it at 25

C or less and 65% RH or less for the allowable storage period.

Caution

Do not use different soldering methods together (except for partial heating).