Intel Xeon Dual-Core 5050 HH80555KF0804M Scheda Tecnica

Dual-Core Intel® Xeon® Processor 5000 Series Datasheet 

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A ‘#’ symbol after a signal name refers to an active low signal, indicating a signal is in 
the asserted state when driven to a low level. For example, when RESET# is low, a 
reset has been requested. Conversely, when NMI is high, a nonmaskable interrupt has 
occurred. In the case of signals where the name does not imply an active state but 
describes part of a binary sequence (such as address or data), the ‘#’ symbol implies 
that the signal is inverted. For example, D[3:0] = ‘HLHL’ refers to a hex ‘A’, and 
D[3:0]# = ‘LHLH’ also refers to a hex ‘A’ (H= High logic level, L= Low logic level).

Commonly used terms are explained here for clarification:

• Dual-Core Intel

 Processor 5000 Series – Processor in the FC-LGA6 

package with two physical processor cores. Dual-Core Intel Xeon processor 5000 
series refers to the “Full Power” Dual-Core Intel Xeon Processor 5000 series with 
1066 MHz Front Side Bus. For this document, “processor” is used as the generic 
term for the “Dual-Core Intel

®

 Xeon

®

 Processor 5000 series”.

• Dual-Core Intel

 Processor 5063 (MV) – This is a lower power version 

of the Dual-Core Intel Xeon Processor 5000 series. Dual-Core Intel Xeon Processor 
5063 (MV) refers to the “Mid Power” Dual-Core Intel Xeon Processor 5000 series. 
Unless otherwise noted, the terms “Dual-Core Intel Xeon 5000 series” and 
“processor” also refer to the “Dual-Core Intel Xeon Processor 5063”.

• FC-LGA6 (Flip Chip Land Grid Array) Package – The Dual-Core Intel Xeon 

Processor 5000 series package is a Land Grid Array, consisting of a processor core 
mounted on a pinless substrate with 771 lands, and includes an integrated heat 
spreader (IHS).

• FSB (Front Side Bus) – The electrical interface that connects the processor to the 

chipset. Also referred to as the processor front side bus or the front side bus. All 
memory and I/O transactions as well as interrupt messages pass between the 
processor and chipset over the FSB.

• Functional Operation – Refers to the normal operating conditions in which all 

processor specifications, including DC, AC, FSB, signal quality, mechanical and 
thermal are satisfied.

• Storage Conditions – Refers to a non-operational state. The processor may be 

installed in a platform, in a tray, or loose. Processors may be sealed in packaging or 
exposed to free air. Under these conditions, processor lands should not be 
connected to any supply voltages, have any I/Os biased or receive any clocks. 
Upon exposure to “free air” (that is, unsealed packaging or a device removed from 
packaging material) the processor must be handled in accordance with moisture 
sensitivity labeling (MSL) as indicated on the packaging material.

• Priority Agent – The priority agent is the host bridge to the processor and is 

typically known as the chipset.

• Symmetric Agent – A symmetric agent is a processor which shares the same I/O 

subsystem and memory array, and runs the same operating system as another 
processor in a system. Systems using symmetric agents are known as Symmetric 
Multiprocessing (SMP) systems. 

• Integrated Heat Spreader (IHS) – A component of the processor package used 

to enhance the thermal performance of the package. Component thermal solutions 
interface with the processor at the IHS surface.

• Enhanced Intel SpeedStep Technology – The next generation implementation 

of Intel SpeedStep technology which extends power management capabilities of 
servers and workstations.