Intel Xeon Dual-Core 5050 HH80555KF0804M Scheda Tecnica
Codici prodotto
HH80555KF0804M
Dual-Core Intel® Xeon® Processor 5000 Series Datasheet
91
Boxed Processor Specifications
8.2.1
Boxed Processor Heat Sink Dimensions (CEK)
The boxed processor will be shipped with an unattached thermal solution. Clearance is
required around the thermal solution to ensure unimpeded airflow for proper cooling.
The physical space requirements and dimensions for the boxed processor and
assembled heat sink are shown in
required around the thermal solution to ensure unimpeded airflow for proper cooling.
The physical space requirements and dimensions for the boxed processor and
assembled heat sink are shown in
.
through
connector used for the active CEK fan heat sink solution.