Nxp Semiconductors TDA8932B Manuale Utente
TDA8932B_3
© NXP B.V. 21 June 2007. All rights reserved.
Product data sheet
Rev. 03— 21 June 2007
45 of 48
NXP Semiconductors
TDA8932B
Class-D audio amplifier
For further information on temperature profiles, refer to Application Note
AN10365
“Surface mount reflow soldering description”.
18. Abbreviations
MSL: Moisture Sensitivity Level
Fig 42. Temperature profiles for large and small components
001aac844
temperature
time
minimum peak temperature
= minimum soldering temperature
maximum peak temperature
= MSL limit, damage level
peak
temperature
Table 18.
Abbreviations
Acronym
Description
BTL
Bridge Tied Load
DMOS
Double diffused Metal Oxide Semiconductor
ESD
ElectroStatic Discharge
OCP
OverCurrent Protection
OTP
OverTemperature Protection
OVP
OverVoltage Protection
PWM
Pulse Width Modulation
SE
Single-Ended
TF
Thermal Foldback
UBP
UnBalance Protection
UVP
UnderVoltage Protection
WP
Window Protection