u-blox AG VERAP174 Manuale Utente
VERA-P1 series - Data Sheet
UBX-17004377 - R06_draft
Product handling & soldering
Page 23 of 30
Confidential
7.2 Shipment, storage and handling
For more information regarding shipment, storage and handling see the u-blox Package Information
Guide
Guide
7.2.1 Moisture sensitivity levels
The VERA-P1 series modules are rated at moisture sensitivity level 3. See moisture sensitive warning
label on each shipping bag for detailed information. After opening the dry pack, modules must be
mounted within 168 hours in factory conditions of maximum 30 °C/60%RH or must be stored at less
than 10%RH. Modules require baking if the humidity indicator card shows more than 10% when read
at 23±5°C or if the conditions mentioned above are not met. Please refer to J-STD-033B standard for
bake procedure.
label on each shipping bag for detailed information. After opening the dry pack, modules must be
mounted within 168 hours in factory conditions of maximum 30 °C/60%RH or must be stored at less
than 10%RH. Modules require baking if the humidity indicator card shows more than 10% when read
at 23±5°C or if the conditions mentioned above are not met. Please refer to J-STD-033B standard for
bake procedure.
7.2.2 Mounting process and soldering recommendations
The VERA-P1 series module is a surface mount module supplied on an 8-layer FR4-type PCB with gold
plated connection pins and produced in a lead-free process with a lead-free soldering paste. The wrap
page of the PCB is max. 0.75% according to IPC-A-610E. The thickness of solder resist on the host
PCB top side and the JODY-W1 bottom side must be considered for the soldering process.
plated connection pins and produced in a lead-free process with a lead-free soldering paste. The wrap
page of the PCB is max. 0.75% according to IPC-A-610E. The thickness of solder resist on the host
PCB top side and the JODY-W1 bottom side must be considered for the soldering process.
This module is compatible with industrial reflow profile for RoHS/Pb-free solders, Sn96.5/Ag3.0/Cu0.5
solder is a right choice. Use of "No Clean" soldering paste is strongly recommended, cleaning the
populated modules is strongly discouraged - residuals under the module cannot be easily removed
with any cleaning process. Cleaning with water can lead to capillary effects where water is absorbed
into the gap between the host board and module. The combination of soldering flux residuals and
encapsulated water could lead to short circuits between neighboring pins.
solder is a right choice. Use of "No Clean" soldering paste is strongly recommended, cleaning the
populated modules is strongly discouraged - residuals under the module cannot be easily removed
with any cleaning process. Cleaning with water can lead to capillary effects where water is absorbed
into the gap between the host board and module. The combination of soldering flux residuals and
encapsulated water could lead to short circuits between neighboring pins.
Only a single reflow soldering process is permitted for host boards with the VERA-P1 series
modules.
The reflow profile used is dependent on the thermal mass of the entire populated PCB, heat transfer
efficiency of the oven and particular type of solder paste used. Since the profile used is process and
layout dependent, the optimum profile should be studied case by case. Recommendations below
should be taken as a starting point guide. In case of basic information necessity, refer to J-STD-020C
standard.
modules.
The reflow profile used is dependent on the thermal mass of the entire populated PCB, heat transfer
efficiency of the oven and particular type of solder paste used. Since the profile used is process and
layout dependent, the optimum profile should be studied case by case. Recommendations below
should be taken as a starting point guide. In case of basic information necessity, refer to J-STD-020C
standard.
Profile feature
Sn-Pb eutectic
(Sn63/Pb37)
(Sn63/Pb37)
RoHS/Pb-free
(Sn96.5/Ag3.0/Cu0.5)
(Sn96.5/Ag3.0/Cu0.5)
Ramp up rate (T
SMAX
to T
P
)
3 °C/sec max
3 °C/sec max
Minimum soak temperature (T
SMIN
)
100 °C
150 °C
Maximum soak temperature (T
SMAX
)
150 °C
200 °C
Soak time (ts)
60 - 120 sec
60 - 180 sec
Liquidus temperature (T
L
)
183 °C
217 °C
Time above T
L
(t
L
)
60 - 150 sec
60 - 150 sec
Peak temperature (T
P
)
215 – 225 °C
235 – 245 °C
Time within +0 / -5°C of actual TP (tp)
10 - 30 sec
20 - 40 sec
Ramp down rate
6 °C/sec max
6 °C/sec max
Time from 25°C to T
P
6 min max
8 min max
Table 15: Recommended reflow profile
☞
The lowest value of T
P
and slower ramp down rate (2 – 3 °C/sec) is preferred.