ZTE Corporation MG2636 Manuale Utente

Pagina di 27
 
                                                                        MG2636 module 
                                                                                                     
23
6.  Antenna Interface 
The RF interface of the MG2636 Module has an impedance of 50 . The module is capable of sustaining a 
total mismatch at the antenna connector or pad without any damage, even when transmitting at maximum RF 
power. 
The external antenna must be matched properly to achieve best performance regarding radiated power, 
DC-power consumption, modulation accuracy and harmonic suppression. Antenna matching networks are not 
included on the MG2636 Module PCB and should be placed in the host application. 
Regarding the return loss, the Module provides the following values in the active band: 
                                                Table 6-1 Return Loss in the Active Band 
State of Module
 
Return Loss of 
Module 
Recommended Return Loss of 
Application 
Receive
≥ 8dB
≥ 12dB
Transmit
 
not applicable
≥ 12dB
The connection of the antenna or other equipment must be de coupled from DC voltage. This is 
necessary because the antenna connector is DC coupled to ground via an inductor for ESD protection. 
 
6.1 Antenna Installation 
To suit the physical design of individual applications, the MC2261 offers two alternative approached to 
connecting the antenna: 
■ Recommended approach: 
MM9329-2700B 
antenna connector manufactured by 
MURATA 
assembled on 
the component side of the PCB (top view on Module). See Section 4.3 for details. 
■ Antenna pad and grounding plane placed on the bottom side. See Section 4.2 for details. 
The 
MM9329-2700B 
connector has been chosen as antenna reference point (ARP) for the ZTEMT 
reference equipment submitted to type approve the MG2636 Module. All RF data specified throughout 
this manual are related to the ARP. For compliance with the test results of the ZTEMT type approval 
you are advised to give priority to the connector, rather than using the antenna pad. 
Note: Both solutions can be applied alternatively. This means,if the antenna is connected to the pad, then 
the connector on the Module must be left empty,and when the antenna is connected to the Module connector, 
the pad is useless, 
 
6.2 Antenna Pad 
The antenna pad of the module is soldered to the board on the customer design to connect with RF line. 
For proper grounding connect the RF line to the ground plane on the bottom of the MG2636 Module 
which must be connected to the ground plane of the application. 
Consider that according to GSM recommendations as 50Ω connector is mandatory for type approval 
measurements. It must be ensured that the RF line which is connected to antenna pad should be controlled on 
50Ω. 
 
 
Notes on soldering 
■ To prevent damage to the Module and to obtain long-term solder joint properties, you are advised to 
maintain the standards of good engineering practice for soldering.