Gemalto M2M GmbH ELS61-AUS Manuale Utente

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4.2 Mounting ELS61-AUS onto the Application Platform

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ELS61-AUS_HID_v00.031

2016-06-03

Confidential / Preliminary

Page 78 of 102

Board level characterization issues should also be taken into account if devising an SMT pro-
cess.

Characterization tests should attempt to optimize the SMT process with regard to board level 
reliability. This can be done by performing the following physical tests on sample boards: Peel 
test, bend test, tensile pull test, drop shock test and temperature cycling. Sample surface 
mount checks are described in 

.

It is recommended to characterize land patterns before an actual PCB production, taking indi-
vidual processes, materials, equipment, stencil design, and reflow profile into account. For land 
and stencil pattern design recommendations see also 

. Optimizing the solder 

stencil pattern design and print process is necessary to ensure print uniformity, to decrease sol-
der voids, and to increase board level reliability.

Daisy chain modules for SMT characterization are available on request. For details refer to 

Generally, solder paste manufacturer recommendations for screen printing process parame-
ters and reflow profile conditions should be followed. Maximum ratings are described in 

ELS61-AUS comprises components that are susceptible to damage induced by absorbed 
moisture.

Gemalto M2M’s ELS61-AUS module complies with the latest revision of the IPC/JEDEC J-
STD-020 Standard for moisture sensitive surface mount devices and is classified as MSL 4.

For additional moisture sensitivity level (MSL) related information see 

 and 

.