Getac Technology Corporation RX10RFID Manuale Utente
SLOS743K – AUGUST 2011 – REVISED APRIL 2014
8
Device and Documentation Support
8.1
Documentation Support
The following documents describe the TRF7970A device. Copies of these documents are available on the
Internet at
Internet at
.
TRF7970A Silicon Errata. Describes the known exceptions to the functional specifications
for the TRF7970A.
for the TRF7970A.
8.2
Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the
respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views;
see TI's
respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views;
see TI's
.
TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At
e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow
engineers.
e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow
engineers.
8.3
Trademarks
MSP430 is a trademark of Texas Instruments.
ARM is a registered trademark of ARM Limited.
Bluetooth is a registered trademark of Bluetooth SIG.
MIFARE is a trademark of NXP Semiconductors.
FeliCa is a trademark of Sony Corporation.
Wi-Fi is a registered trademark of Wi-Fi Alliance.
All other trademarks are the property of their respective owners.
ARM is a registered trademark of ARM Limited.
Bluetooth is a registered trademark of Bluetooth SIG.
MIFARE is a trademark of NXP Semiconductors.
FeliCa is a trademark of Sony Corporation.
Wi-Fi is a registered trademark of Wi-Fi Alliance.
All other trademarks are the property of their respective owners.
8.4
Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
8.5
Glossary
— TI Glossary.
This glossary lists and explains terms, acronyms and definitions.
9
Mechanical Packaging and Orderable Information
9.1
Packaging Information
The following pages include mechanical packaging and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and
revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
current data available for the designated devices. This data is subject to change without notice and
revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
80
Mechanical Packaging and Orderable Information
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