Intel III Xeon 700 MHz 80526KY7001M Manuale Utente
Codici prodotto
80526KY7001M
THERMAL SPECIFICATIONS
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the design of the heatsink and airflow around the heatsink. General Information on thermal interfaces and
heatsink design constraints can be found in AP-586, Pentium II Processor Thermal Design Guidelines (Order
Number 243331).
heatsink design constraints can be found in AP-586, Pentium II Processor Thermal Design Guidelines (Order
Number 243331).
6.2.2
THERMAL PLATE TO HEAT SINK INTERFACE MANAGEMENT GUIDE
Figure 19 shows suggested interface agent dispensing areas when using either Intel suggested interface
agent. System issues in meeting the TPLATE requirements will determine actual user area and interface
agent selections.
agent. System issues in meeting the TPLATE requirements will determine actual user area and interface
agent selections.
Figure 19. Interface Agent Dispensing Areas and Thermal Plate Temperature Measurement
Points
NOTES:
6.
Interface agent suggestions: ShinEtsu* G749 or Thermoset* TC330; Dispense volume adequate to ensure required
minimum area of coverage when cooling solution is attached. Areas A and B are suggested for processor core and
OCVR products. Recommended cooling solution mating surface flatness is no greater than 0.007” or flatter.
minimum area of coverage when cooling solution is attached. Areas A and B are suggested for processor core and
OCVR products. Recommended cooling solution mating surface flatness is no greater than 0.007” or flatter.
7.
Temperature of the entire thermal plate surface not to exceed 65
°C. Use any combination of interface agent, cooling
solution, flatness condition, etc., to ensure this condition is met. Thermocouple measurement locations are the
expected high temperature locations without external heat source influence. Ensure that external heat sources do not
cause a violation of TPLATE requirements
expected high temperature locations without external heat source influence. Ensure that external heat sources do not
cause a violation of TPLATE requirements
6.2.3
MEASUREMENTS FOR THERMAL SPECIFICATIONS
6.2.3.1 Plate
Temperature
Measurement