Intel III Xeon 700 MHz 80526KY7002M Manuale Utente
Codici prodotto
80526KY7002M
MECHANICAL SPECIFICATIONS
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7. MECHANICAL SPECIFICATIONS
The processor use S.E.C. cartridge package technology. The S.E.C. cartridge contains the processor core,
OCVR and other components. The S.E.C. cartridge package connects to the baseboard through an edge
connector. Mechanical specifications for the processor are given in this section. See Section 1.1.1 for a
complete terminology listing.
Figure 22 shows the thermal plate side view and the cover side view of the processor. Figure 23 shows the
S.E.C. cartridge cooling solution attachment feature details on the thermal plate and depict package form
factor dimensions and retention enabling features of the S.E.C. cartridge. The processor edge connector
defined in this document is referred to as "SC330.1". This connector definition is mechanically the same as
the existing SC 300 (formerly Slot 2). See the SC330 connector specifications for further details on the edge
connector.
Table 50 and Table 51 provide the edge finger and SC330.1 connector signal definitions for processor. The
signal locations on the SC330 edge connector are to be used for signal routing, simulation and component
placement on the baseboard.
OCVR and other components. The S.E.C. cartridge package connects to the baseboard through an edge
connector. Mechanical specifications for the processor are given in this section. See Section 1.1.1 for a
complete terminology listing.
Figure 22 shows the thermal plate side view and the cover side view of the processor. Figure 23 shows the
S.E.C. cartridge cooling solution attachment feature details on the thermal plate and depict package form
factor dimensions and retention enabling features of the S.E.C. cartridge. The processor edge connector
defined in this document is referred to as "SC330.1". This connector definition is mechanically the same as
the existing SC 300 (formerly Slot 2). See the SC330 connector specifications for further details on the edge
connector.
Table 50 and Table 51 provide the edge finger and SC330.1 connector signal definitions for processor. The
signal locations on the SC330 edge connector are to be used for signal routing, simulation and component
placement on the baseboard.
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Figure 22. Isometric View of S.E.C. Cartridge
NOTES:
Use of retention holes and retention indents are optional.
11. For SC330 connector specifications, see the SC330 Connector Specification.
12. All dimensions in inches for figures 23 thru 28.
12. All dimensions in inches for figures 23 thru 28.