Goodram 8GB DDR2-800 GR800D264L5/8GDC Dépliant

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GR800D264L5/8GDC
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professional  memory  for  everyone
BYTE
DESCRIPTION
0
Number of Serial PD Bytes written during module production
1
Total number of Bytes in Serial PD device
2
Fundamental Memory Type (FPM, EDO, SDRAM …)
3
Number of Row Addresses on this assembly
4
Number of Column Addresses on this assembly
5
Number of DIMM Banks
6
Data Width of this assembly
7
Data Width of this assembly
8
Voltage Interface Level of this assembly
9
SDRAM Cycle time at Maximum Supported CAS Latency (CL), CL=X
10
SDRAM Access from Clock
11
DIMM configuration type (Non-parity, Parity or ECC)
12
Refresh Rate/Type
13
Primary SDRAM Width
14
Error Checking SDRAM Width
15
SDRAM Device Attributes: Minimum Clock Delay, Back-to-Back RCA
16
SDRAM Device Attributes: Burst Lengths Supported
17
SDRAM Device Attributes: Number of Banks on SDRAM Device
18
SDRAM Device Attributes: CAS Latency
19
SDRAM Device Attributes: CS Latency
20
SDRAM Device Attributes: Write Latency/DIMM Type Information
21
SDRAM Module Attributes
22
SDRAM Device Attributes: General
23
Minimum Clock Cycle at CL = X - 0.5
24
Maximum Data Access Time (tAC) from Clock at CL = X - 0.5
25
Minimum Clock Cycle at CL = X - 1
26
Maximum Data Access Time (tAC) from Clock at CL = X - 1
27
Minimum Row Precharge Time (tRP)
28
Minimum Row Active to Row Active delay (tRRD)
29
Minimum RAS to CAS delay (tRCD)
30
Minimum Active to Precharge Time (tRAS)
31
Module Bank Density
32
Address and Command Input Setup Time Before Clock
33
Address and Command Input Hold Time After Clock
34
Data Input Setup Time Before Clock
35
Data Input Hold Time After Clock
36
Write recovery time (tWR)
37
Internal write to read command delay (tWTR)
38
Internal read to precharge command delay (tRTP)
39
Memory Analysis Probe Characteristics
40
Extension of Byte 41 tRC and Byte 42 tRFC
41
SDRAM Device Minimum Active to Active/Auto Refresh Time (tRC)
42
SDRAM Device Minimum Auto Refresh to Active/Auto Refresh (tRFC)
43
SDRAM Device Maximum device cycle time (tCKmax)
44
SDRAM Device Maximum skew between DQS and DQ signals (tDQSQ)
45
DDR SDRAM Device Maximum Read Data Hold Skew Factor (tQHS)
46
Reserved for future use
47
SDRAM Device Attributes - DDR SDRAM DIMM Height
48
Reserved for future use
49
Reserved for future use
50
Reserved for future use
51
Reserved for future use
52
Reserved for future use
53
Reserved for future use
54
Reserved for future use
55
Reserved for future use
56
Reserved for future use
57
Reserved for future use
58
Reserved for future use
59
Reserved for future use
60
Reserved for future use
61
Reserved for future use
62
SPD Revision
63
Checksum for Bytes 0-62
64-255
Manufacturer’s specific data
SPD  CONFIGURATION
HEX
0x80
0x08
0x08
0x0F
0x0A
0x61
0x40
0x00
0x05
0x25
0x40
0x00
0x82
0x08
0x00
0x00
0x0C
0x08
0x70
0x01
0x02
0x00
0x07
0x25
0x40
0x3D
0x50
0x32
0x1E
0x32
0x2D
0x02
0x17
0x25
0x05
0x12
0x3C
0x1E
0x1E
0x00
0x30
0x39
0xC3
0x80
0x14
0x1E
0x0F
0x50
0x60
0x5F
0x44
0x43
0x31
0x49
0x2F
0x72
0x3A
0x43
0x00
0x00
0x00
0x00
0x11
0x66
DEC
128
8
8
15
10
97
64
0
5
37
64
0
130
8
0
0
12
8
112
1
2
0
7
37
64
61
80
50
30
50
45
2
23
37
5
18
60
30
30
0
48
57
195
128
20
30
15
80
96
95
68
67
49
73
47
114
58
67
0
0
0
0
17
102
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Wilk Elektronik S.A.
Poland, 43-174 Łaziska Górne, ul. Mikołowska 42
tel.: 0-32/ 736 90 00, fax: 0-32/ 736 90 01
www.wilk.com.pl  
l
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©  Wilk Elektronik S.A. 2009 
                                             
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MEMORY MODULE SPECIFICATION