Intel G530 BXC80623G530 Manuale Utente
Codici prodotto
BXC80623G530
10
Intel
®
Celeron
®
Processor on 0.13 Micron Process in the 478-Pin Package
Datasheet
Introduction
“System Bus” refers to the interface between the processor and system core logic (the chipset
components). The system bus is a multiprocessing interface to processors, memory, and I/O.
components). The system bus is a multiprocessing interface to processors, memory, and I/O.
1.1.1
Processor Packaging Terminology
The following are commonly used terms:
•
Intel
®
Celeron
®
processor on 0.13 micron process and in the 478-pin package (also
referred as the Intel
®
Celeron
®
processor on 0.13 micron process or processor) —
0.13 micron processor core in the 478-pin FC-PGA2 package with a 128-KB L2 cache.
•
Intel
£
Celeron
£
processor in the 478-pin package — 0.18 micron processor core in the
478-pin FC-PGA2 package with a 128-KB L2 cache.
•
Intel
£
Pentium
£
4 processor with 512-KB L2 cache on 0.13 micron process —
0.13 micron process version of Pentium 4 processor in the 478-pin FC-PGA2 package with a
512-KB L2 cache.
512-KB L2 cache.
•
Processor — For this document, the term processor means Celeron processor on 0.13 micron
process.
process.
•
Keep-Out Zone — The area on or near the processor that system design can not use. This area
must be kept free of all components to make room for the processor package, retention
mechanism, heatsink, and heatsink clips.
must be kept free of all components to make room for the processor package, retention
mechanism, heatsink, and heatsink clips.
•
Intel
®
850 chipset — Chipset that supports RDRAM* memory technology for Celeron
processor on 0.13 micron process.
•
Intel
®
845 chipset — Chipset that supports PC133 and DDR memory technology for the
Celeron processor on 0.13 micron process.
•
Intel
®
845G chipset — Chipset with embedded graphics that supports DDR memory
technology for the Celeron processor on 0.13 micron process.
•
Intel
®
845E chipset — Chipset that supports DDR memory technology for the Celeron
processor on 0.13 micron process.
•
Processor core — Celeron processor on 0.13 micron process core die with integrated
L2 cache.
L2 cache.
•
FC-PGA2 package — Flip-Chip Pin Grid Array package with 50-mil pin pitch and Integrated
Heat Spreader.
Heat Spreader.
•
mPGA478B socket — Surface mount, 478 pin, Zero Insertion Force (ZIF) socket with 50-mil
pin pitch. The socket mates the processor to the system board.
pin pitch. The socket mates the processor to the system board.
•
Integrated heat spreader — The surface used to make contact between a heatsink or other
thermal solution and the processor. Abbreviated IHS.
thermal solution and the processor. Abbreviated IHS.
•
Retention mechanism — The structure mounted on the system board that provides support
and retention of the processor heatsink.
and retention of the processor heatsink.