Intel i5-2540M FF8062700839209 Manuale Utente
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FF8062700839209
Thermal Management
54
Datasheet
default register value after reset of the processor. Altering this MSR value may result in
unpredictable behavior.
5.1.2
Intel Turbo Boost Technology and Graphics Dynamic
Frequency Thermal Design Considerations and
Specifications
When designing a thermal solution for Intel Turbo Boost Technology and/or Graphics
Dynamic Frequency enabled processor:
• Both component TDPs as well as extreme thermal power levels for the processor
core and integrated graphics and memory controller must be considered.
• Note that the processor can consume close to its maximum thermal power limit
more frequently, and for prolonged periods of time.
• One must ensure that the component T
j,max
limits are not exceeded when either
component is operating at its extreme thermal power limit.
There are two “extreme” design points:
• The processor core operating at maximum thermal power level (which is greater
than its component TDP) and the integrated graphics and memory controller
operating at its minimum thermal power.
• The integrated graphics operates at its maximum thermal power level, while the
processor core consumes the remaining thermal power budget.
In both cases, the combined component thermal power will not exceed the total MCP
package power limit. The design approach accommodating two extreme power levels is
referred to as a “two-point” design.
The following notes apply to
.
Note
Definition
1
The component TDPs given are not the maximum power the components can generate. Analysis
indicates that real applications are unlikely to cause the processor to consume the theoretical
maximum power dissipation for sustained periods of time.
indicates that real applications are unlikely to cause the processor to consume the theoretical
maximum power dissipation for sustained periods of time.
2
A range of power is to be expected among the components due to the natural variation in the
manufacturing process. Nevertheless, the individual component powers are not to exceed the
component TDPs specified.
manufacturing process. Nevertheless, the individual component powers are not to exceed the
component TDPs specified.
3
Concurrent package power refers to the actual power consumed by the package while TDP
applications are running simultaneously by the processor core and the integrated graphics
controller. An example of this could be the processor core running a Prime95* application, and the
integrated graphics core running a Star Wars: Jedi Knight* menu simultaneously.
applications are running simultaneously by the processor core and the integrated graphics
controller. An example of this could be the processor core running a Prime95* application, and the
integrated graphics core running a Star Wars: Jedi Knight* menu simultaneously.
4
The thermal solution needs to ensure that the temperatures of both components do not exceed the
maximum junction temperature (T
maximum junction temperature (T
j,max
) limit, as measured by the DTS and the critical temperature
bit.
5
Processor core and integrated graphics and memory controller junction temperatures are monitored
by their respective DTS. A DTS outputs a temperature relative to the maximum supported junction
temperature. The error associated with DTS measurements will not exceed ±5°C within the
operating range.
by their respective DTS. A DTS outputs a temperature relative to the maximum supported junction
temperature. The error associated with DTS measurements will not exceed ±5°C within the
operating range.
6
The power supply to the processor core and the integrated graphics /Memory core should be
designed as per Intel’s guidelines.
designed as per Intel’s guidelines.
7
Processor core currents is monitored by IMON VR feedback (ISENSE) and calculated using a moving
average method. Error associated with power monitoring will depend upon individual VR design.
average method. Error associated with power monitoring will depend upon individual VR design.