Intel i3-3250 CM8063701392200 Manuale Utente

Intel

Codici prodotto

CM8063701392200

Datasheet, Volume 1

3

Contents

Introduction ..............................................................................................................9
1.1

Processor Feature Details ................................................................................... 11
1.1.1

Supported Technologies .......................................................................... 11

Interfaces ........................................................................................................ 11
1.2.1

System Memory Support ......................................................................... 11

PCI Express* ......................................................................................... 12

Direct Media Interface (DMI).................................................................... 14

Platform Environment Control Interface (PECI) ........................................... 14

Processor Graphics ................................................................................. 14

Flexible Display Interface (Intel

®

FDI) ............................................. 15

Power Management Support ............................................................................... 15
1.3.1

Processor Core....................................................................................... 15

System ................................................................................................. 15

Memory Controller.................................................................................. 15

PCI Express* ......................................................................................... 16

Direct Media Interface (DMI).................................................................... 16

Processor Graphics Controller (GT) ........................................................... 16

Thermal Management Support ................................................................. 16

Processor SKU Definitions................................................................................... 16

Package ........................................................................................................... 17

Processor Compatibility ...................................................................................... 18

Terminology ..................................................................................................... 19

Related Documents............................................................................................ 22

Interfaces................................................................................................................ 23
2.1

System Memory Interface................................................................................... 23
2.1.1

System Memory Technology Supported ..................................................... 23

System Memory Timing Support............................................................... 24

System Memory Organization Modes......................................................... 25
2.1.3.1

Single-Channel Mode................................................................. 25

Dual-Channel Mode – Intel

®

Flex Memory Technology Mode ........... 25

Rules for Populating Memory Slots ............................................................ 26

Technology Enhancements of Intel

Fast Memory Access (Intel

FMA).......... 27

Just-in-Time Command Scheduling.............................................. 27

Command Overlap .................................................................... 27

Out-of-Order Scheduling ............................................................ 27

Data Scrambling .................................................................................... 27

DDR3 Reference Voltage Generation ......................................................... 27

PCI Express* Interface....................................................................................... 28
2.2.1

PCI Express* Architecture ....................................................................... 28
2.2.1.1

Transaction Layer ..................................................................... 29

Data Link Layer ........................................................................ 29

Physical Layer .......................................................................... 29

PCI Express* Configuration Mechanism ..................................................... 30

PCI Express* Port................................................................................... 31
2.2.3.1

PCI Express* Lanes Connection .................................................. 31

Direct Media Interface (DMI)............................................................................... 32
2.3.1

DMI Error Flow....................................................................................... 32

Processor / PCH Compatibility Assumptions................................................ 32

DMI Link Down ...................................................................................... 32

Processor Graphics Controller (GT) ...................................................................... 33