Intel Phi 7120A SC7120A Scheda Tecnica
Codici prodotto
SC7120A
Document ID Number: 328209 003EN
Intel
®
Xeon Phi™ Coprocessor Datasheet
21
3.3.2
7120P/SE10P/5110P/3120P/31S1P Passive Cooling
Solution
For the passive heat sink on the 7120P/SE10P/5110P/3120P/31S1P SKUs, the Intel
®
Xeon Phi™ coprocessor thermal & mechanical solution also utilizes a 'fuselage/
supersink' approach.
supersink' approach.
illustrates the key components of the passive design.
As in the active thermal solution, the duct is metallic and performs both structural and
thermal roles. In its 'fuselage' function, the duct provides structural support for the
forces generated by the CPU thermal interface, protects against shock events, and
channels airflow through the card. In its 'supersink' function, the duct contains internal
fins and heat pipes. The internal heat pipes serve to transmit heat from GDDR (both
top- and bottom-side) and VR components to the internal fin banks, diecast blower
frame, and metal fuselage structure where it can be effectively transferred to the
airstream. The passive solution does not have a diecast blower frame as it relies upon
forced airflow from the host system. In place of the blower and frame, an additional fin
bank is added to dissipate waste heat from GDDR and VR components. The fin spacing
of all fin banks as well as of the CPU heat sink fin bank have been optimized for
receiving system-supplied airflow. A backplate stiffener/heat sink is used.
thermal roles. In its 'fuselage' function, the duct provides structural support for the
forces generated by the CPU thermal interface, protects against shock events, and
channels airflow through the card. In its 'supersink' function, the duct contains internal
fins and heat pipes. The internal heat pipes serve to transmit heat from GDDR (both
top- and bottom-side) and VR components to the internal fin banks, diecast blower
frame, and metal fuselage structure where it can be effectively transferred to the
airstream. The passive solution does not have a diecast blower frame as it relies upon
forced airflow from the host system. In place of the blower and frame, an additional fin
bank is added to dissipate waste heat from GDDR and VR components. The fin spacing
of all fin banks as well as of the CPU heat sink fin bank have been optimized for
receiving system-supplied airflow. A backplate stiffener/heat sink is used.
3.3.2.1
System Airflow for 5110P SKUs
In order to ensure adequate cooling of the 5110P SKUs with a 45
o
C inlet temperature,
the system must be able to provide 20 ft
3
/min of airflow to the card with 4.3 ft
3
/min on
the secondary side and the remainder on the primary side. The total pressure drop
(assuming a multi-card installation conforming to the PCI Express* mechanical
specification) is 0.21 inch H
(assuming a multi-card installation conforming to the PCI Express* mechanical
specification) is 0.21 inch H
2
O at this flow rate.
Note:
For systems with reversed airflow, the corresponding airflow requirement is expected
to be within +/-5% tolerance of the values shown in the following tables.
Figure 3-5
Exploded View of Passive Thermal Solution