Fujifilm Xeon DP 5140 S26361-F3321-L233 Scheda Tecnica
Codici prodotto
S26361-F3321-L233
Introduction
14
Dual-Core Intel
®
Xeon
®
Processor 5100 Series Datasheet
• Priority Agent – The priority agent is the host bridge to the processor and is
typically known as the chipset.
• Symmetric Agent – A symmetric agent is a processor which shares the same I/O
subsystem and memory array, and runs the same operating system as another
processor in a system. Systems using symmetric agents are known as Symmetric
Multiprocessing (SMP) systems.
processor in a system. Systems using symmetric agents are known as Symmetric
Multiprocessing (SMP) systems.
• Integrated Heat Spreader (IHS) – A component of the processor package used
to enhance the thermal performance of the package. Component thermal solutions
interface with the processor at the IHS surface.
interface with the processor at the IHS surface.
• Thermal Design Power – Processor thermal solutions should be designed to meet
this target. It is the highest expected sustainable power while running known
power intensive real applications. TDP is not the maximum power that the
processor can dissipate.
power intensive real applications. TDP is not the maximum power that the
processor can dissipate.
• Intel
®
Extended Memory 64 Technology (Intel
®
EM64T) – An enhancement
to Intel's IA-32 architecture that allows the processor to execute operating systems
and applications written to take advantage of the 64-bit extension technology.
Further details on can be found in the 64-bit Extension Technology Software
Developer's Guide at
and applications written to take advantage of the 64-bit extension technology.
Further details on can be found in the 64-bit Extension Technology Software
Developer's Guide at
http://developer.intel.com/
.
• Enhanced Intel SpeedStep
®
Technology (EIST) – Technology that provides
power management capabilities to servers and workstations.
• Platform Environment Control Interface (PECI) – A proprietary one-wire bus
interface that provides a communication channel between Intel processor and
chipset components to external thermal monitoring devices, for use in fan speed
control. PECI communicates readings from the processor’s digital thermal sensor.
PECI replaces the thermal diode available in previous processors.
chipset components to external thermal monitoring devices, for use in fan speed
control. PECI communicates readings from the processor’s digital thermal sensor.
PECI replaces the thermal diode available in previous processors.
• Intel
®
Virtualization Technology – Processor virtualization which when used in
conjunction with Virtual Machine Monitor software enables multiple, robust
independent software environments inside a single platform.
independent software environments inside a single platform.
• VRM (Voltage Regulator Module) – DC-DC converter built onto a module that
interfaces with a card edge socket and supplies the correct voltage and current to
the processor based on the logic state of the processor VID bits.
the processor based on the logic state of the processor VID bits.
• EVRD (Enterprise Voltage Regulator Down) – DC-DC converter integrated onto
the system board that provides the correct voltage and current to the processor
based on the logic state of the processor VID bits.
based on the logic state of the processor VID bits.
• V
CC
– The processor core power supply.
• V
SS
– The processor ground.
• V
TT
– FSB termination voltage. (Note: In some Intel processor EMTS documents,
V
TT
is instead called V
CCP
.)
1.2
State of Data
The data contained within this document is the most accurate information available by
the publication date of this document. Values are subject to change prior to production.
the publication date of this document. Values are subject to change prior to production.
1.3
References
Material and concepts available in the following documents may be beneficial when
reading this document:
reading this document: