Fujifilm Xeon 5060 S26361-F3318-L320 Scheda Tecnica

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Dual-Core Intel

® 

Xeon

® 

Processor 5100 Series Datasheet

The LAI is installed between the processor socket and the processor. The LAI plugs into 
the socket, while the processor plugs into a socket on the LAI. Cabling that is part of 
the LAI egresses the system to allow an electrical connection between the processor 
and a logic analyzer. The maximum volume occupied by the LAI, known as the keepout 
volume, as well as the cable egress restrictions, should be obtained from the logic 
analyzer vendor. System designers must make sure that the keepout volume remains 
unobstructed inside the system. Note that it is possible that the keepout volume 
reserved for the LAI may include differerent requirements from the space normally 
occupied by the heatsink. If this is the case, the logic analyzer vendor will provide a 
cooling solution as part of the LAI.

The LAI will also affect the electrical performance of the FSB, therefore it is critical to 
obtain electrical load models from each of the logic analyzer vendors to be able to run 
system level simulations to prove that their tool will work in the system. Contact the 
logic analyzer vendor for electrical specifications and load models for the LAI solution 
they provide.