Intel 4 3.20 GHz BX80532PG3200F Manuale Utente
Codici prodotto
BX80532PG3200F
70
Intel
®
Pentium
®
4 Processor on 0.13 Micron Process Datasheet
Thermal Specifications and Design Considerations
NOTES:
1. These values are specified at V
CC_MAX
for the processor. Systems must be designed to ensure that the
processor is not subjected to any static V
CC
and I
CC
combination wherein V
CC
exceeds V
CC_MAX
at specified
I
CC
. Refer to loadline specifications in
.
2. The numbers in this column reflect Intel’s recommended design point and are not indicative of the maximum
power the processor can dissipate under worst case conditions. For more details, refer to the
Intel
Intel
®
Pentium
®
4 Processor with 512-KB L2 Cache on 0.13 Micron Process Thermal Design Guidelines
.
3. TDP and T
C
are specified for highest VID only. Processors will be shipped under multiple VIDs for each
frequency; however, the TDP and T
C
specifications will be the same as highest VID specified in the table.
5.1.2
Thermal Metrology
5.1.2.1
Processor Case Temperature Measurement
The maximum and minimum case temperature (T
C
) for the Pentium 4 processor on 0.13 micron
process is specified in
. This temperature specification is meant to help ensure proper
operation of the processor.
illustrates where Intel recommends T
C
thermal
measurements should be made. For detailed guidelines on temperature measurement methodology,
refer to the Intel
refer to the Intel
®
Pentium
®
Processor 4 with 512-KB L2 Cache on 0.13 Micron Process Thermal
Design Guidelines.
Figure 5-2. Guideline Locations for Case Temperature (T
C
) Thermocouple Placement
Measure Tcase
At this point
At this point
Thermal Interface
Material should cover the
entire surface of the
Integrated Heat Spreader
Material should cover the
entire surface of the
Integrated Heat Spreader
0.689”
17.5 mm
17.5 mm
0.689”
17.5 mm
17.5 mm
35 mm Package