Intel Pentium 4 641 HH80552PG0882M Manuale Utente
Codici prodotto
HH80552PG0882M
74
Datasheet
Thermal Specifications and Design Considerations
The case temperature is defined at the geometric top center of the processor IHS. Analysis indicates
that real applications are unlikely to cause the processor to consume maximum power dissipation for
sustained periods of time. Intel recommends that complete thermal solution designs target the
Thermal Design Power (TDP) indicated in
that real applications are unlikely to cause the processor to consume maximum power dissipation for
sustained periods of time. Intel recommends that complete thermal solution designs target the
Thermal Design Power (TDP) indicated in
instead of the maximum processor power
consumption. The Thermal Monitor feature is intended to help protect the processor in the unlikely
event that an application exceeds the TDP recommendation for a sustained period of time. For more
details on the usage of this feature, refer to
event that an application exceeds the TDP recommendation for a sustained period of time. For more
details on the usage of this feature, refer to
. In all cases, the Thermal Monitor feature
must be enabled for the processor to remain within specification.
Table 5-1. Processor Thermal Specifications
Core Frequency
(GHz)
Thermal Design
Power (W)
Minimum T
C
(°C)
Maximum T
C
(°C)
Notes
3.20F (PRB = 0)
84
5
See
,
3.40F (PRB = 1)
115
5
See
1, 2
NOTES:
1.
Thermal Design Power (TDP) should be used for processor thermal solution design targets. The TDP is not the
maximum power that the processor can dissipate.
maximum power that the processor can dissipate.
2.
This table shows the maximum TDP for a given frequency range. Individual processors may have a lower TDP.
Therefore, the maximum Tc will vary depending on the TDP of the individual processor. Refer to thermal profile
figure and associated table for the allowed combinations of power and Tc.
Therefore, the maximum Tc will vary depending on the TDP of the individual processor. Refer to thermal profile
figure and associated table for the allowed combinations of power and Tc.
3.60F (PRB = 1)
115
5
See
,
3.80F (PRB = 1)
115
5
See
,
Table 5-2. Thermal Profile for Processors with PRB = 1 (Sheet 1 of 2)
Power (W)
Maximum Tc (°C)
Power
Maximum Tc (°C)
0
44.0
60
59.0
2
44.5
62
59.5
4
45.0
64
60.0
6
45.5
66
60.5
8
46.0
68
61.0
10
46.5
70
61.5
12
47.0
72
62.0
14
47.5
74
62.5
16
48.0
76
63.0
18
48.5
78
63.5
20
49.0
80
64.0
22
49.5
82
64.5
24
50.0
84
65.0
26
50.5
86
65.5
28
51.0
88
66.0
30
51.5
90
66.5
32
52.0
92
67.0
34
52.5
94
67.5
36
53.0
96
68.0