Intel 4 530 NE80546PG0801M Scheda Tecnica
Codici prodotto
NE80546PG0801M
Datasheet
75
Boxed Processor Specifications
7
Boxed Processor Specifications
The processor will also be offered as an Intel boxed processor. Intel boxed processors are intended
for system integrators who build systems from baseboards and standard components. The boxed
processor will be supplied with a cooling solution. This chapter documents baseboard and system
requirements for the cooling solution that will be supplied with the boxed processor. This chapter is
particularly important for OEMs that manufacture baseboards for system integrators. Unless
otherwise noted, all figures in this chapter are dimensioned in millimeters and inches [in brackets].
for system integrators who build systems from baseboards and standard components. The boxed
processor will be supplied with a cooling solution. This chapter documents baseboard and system
requirements for the cooling solution that will be supplied with the boxed processor. This chapter is
particularly important for OEMs that manufacture baseboards for system integrators. Unless
otherwise noted, all figures in this chapter are dimensioned in millimeters and inches [in brackets].
shows a mechanical representation of a boxed processor.
Note:
•
Drawings in this section reflect only the specifications on the Intel boxed processor product.
These dimensions should not be used as a generic keep-out zone for all cooling solutions. It is
the system designer's responsibility to consider their proprietary cooling solution when
designing to the required keep-out zone on their system platform and chassis. Refer to the
Intel
These dimensions should not be used as a generic keep-out zone for all cooling solutions. It is
the system designer's responsibility to consider their proprietary cooling solution when
designing to the required keep-out zone on their system platform and chassis. Refer to the
Intel
®
Pentium
®
4 Processor on 90 nm Process Thermal Design Guidelines for further
guidance. Contact your local Intel Sales Representative for this document.
NOTE: The airflow of the fan heatsink is into the center and out of the sides of the fan heatsink.
Figure 15. Mechanical Representation of the Boxed Processor